JAJSG51C September   2018  – February 2022 TCAN1046V-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Ratings
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Characteristics
    6. 6.6  Supply Characteristics
    7. 6.7  Dissipation Ratings
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD1 and TXD2
        2. 8.3.1.2 GND1 and GND2
        3. 8.3.1.3 VCC
        4. 8.3.1.4 RXD1 and RXD2
        5. 8.3.1.5 VIO
        6. 8.3.1.6 CANH and CANL
        7. 8.3.1.7 STB1 and STB2 (Standby)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus Short Circuit Current Limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Standby Mode
        1. 8.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 8.4.4 Driver and Receiver Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

Figure 5-1 D (SOIC) Package, 14 Pin
(Top View)
Figure 5-2 DMT (VSON) Package, 14 Pin
(Top View)
Table 5-1 Pin Functions
Pins Type Description
Name No.
TXD1 1 Digital Input CAN transmit data input 1, integrated pull-up
GND1 2 GND Ground connection
VCC 3 Supply 5-V supply voltage
RXD1 4 Digital Output CAN receive data output 1, tri-state when VIO < UVVIO
GND2 5 GND Ground connection
TXD2 6 Digital Input CAN transmit data input 2, integrated pull-up
RXD2 7 Digital Output CAN receive data output 2, tri-state when VIO < UVVIO
STB2 8 Digital Input Standby input 2 for mode control, integrated pull-up
CANL2 9 Bus IO Low-level CAN bus 2 input or output line
CANH2 10 Bus IO High-level CAN bus 2 input or output line
VIO 11 Supply IO supply voltage
CANL1 12 Bus IO Low-level CAN bus 1 input or output line
CANH1 13 Bus IO High-level CAN bus 1 input or output line
STB1 14 Digital Input Standby input 1 for mode control, integrated pull-up
Thermal Pad (VSON only) — Electrically connected to GND, connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief