JAJSKY4C February   2021  – October 2024 TCAN1057A-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 ESD Ratings Table — IEC Specifications
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Characteristics
    6. 5.6 Supply Characteristics
    7. 5.7 Dissipation Ratings
    8. 5.8 Electrical Characteristics
    9. 5.9 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Description
        1. 7.3.1.1 TXD
        2. 7.3.1.2 GND
        3. 7.3.1.3 VCC
        4. 7.3.1.4 RXD
        5. 7.3.1.5 VIO
        6. 7.3.1.6 CANH and CANL
        7. 7.3.1.7 S (Silent)
      2. 7.3.2 CAN Bus States
      3. 7.3.3 TXD Dominant Timeout (DTO)
      4. 7.3.4 CAN Bus short-circuit current limiting
      5. 7.3.5 Thermal Shutdown (TSD)
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 Unpowered Device
      8. 7.3.8 Floating pins
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Normal Mode
      3. 7.4.3 Silent Mode
      4. 7.4.4 Driver and Receiver Function
  9. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 CAN Termination
      2. 8.2.2 Detailed Design Procedures
        1. 8.2.2.1 Bus Loading, Length and Number of Nodes
      3. 8.2.3 Application Curves
      4. 8.2.4 System Examples
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.5 Thermal Characteristics

THERMAL METRIC(1) TCAN1057Ax-Q1 UNIT
D (SOIC) DDF (SOT) DRB (VSON)
RθJA Junction-to-ambient thermal resistance 127.5 122 55.2 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 63 62.4 ℃/W
RθJB Junction-to-board thermal resistance 70.9 42.4 27.5 ℃/W
ΨJT Junction-to-top characterization parameter 19.3 2.4 2.3 ℃/W
ΨJB Junction-to-board characterization parameter 70.2 42.2 27.4 ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance -- -- 11.5 ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.