JAJSIB4E December   2015  – December 2019 TCAN330 , TCAN330G , TCAN332 , TCAN332G , TCAN334 , TCAN334G , TCAN337 , TCAN337G

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     ブロック図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
    8. 8.8 Typical Characteristics, TCAN330 Receiver
    9. 8.9 Typical Characteristics, TCAN330 Driver
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 TXD Dominant Timeout (TXD DTO)
      2. 10.3.2 RXD Dominant Timeout (RXD DTO)
      3. 10.3.3 Thermal Shutdown
      4. 10.3.4 Undervoltage Lockout and Unpowered Device
      5. 10.3.5 Fault Pin (TCAN337)
      6. 10.3.6 Floating Pins
      7. 10.3.7 CAN Bus Short Circuit Current Limiting
      8. 10.3.8 ESD Protection
      9. 10.3.9 Digital Inputs and Outputs
    4. 10.4 Device Functional Modes
      1. 10.4.1 CAN Bus States
      2. 10.4.2 Normal Mode
      3. 10.4.3 Silent Mode
      4. 10.4.4 Standby Mode with Wake
      5. 10.4.5 Bus Wake via RXD Request (BWRR) in Standby Mode
      6. 10.4.6 Shutdown Mode
      7. 10.4.7 Driver and Receiver Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Bus Loading, Length and Number of Nodes
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
      1. 11.3.1 ISO11898 Compliance of TCAN33x Family of 3.3-V CAN Transceivers Introduction
      2. 11.3.2 Differential Signal
      3. 11.3.3 Common-Mode Signal and EMC Performance
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 関連リンク
    2. 14.2 サポート・リソース
    3. 14.3 商標
    4. 14.4 静電気放電に関する注意事項
    5. 14.5 Glossary
  15. 15メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4 Thermal Information

THERMAL METRIC(1) TCAN33x TCAN33x UNIT
D (SOIC) DCN (SOT-23)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 114.4 154.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 58.7 76.6 °C/W
RθJB Junction-to-board thermal resistance 55.2 49.2 °C/W
ψJT Junction-to-top characterization parameter 11.7 11.9 °C/W
ψJB Junction-to-board characterization parameter 54.6 49.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
PD Average power dissipation VCC = 3.3 V, TJ = 27°C, RL = 60 Ω, SHDN, S and STB at 0 V, Input to TXD at 500 kHz, 50% duty cycle square wave, CL(RXD) = 15 pF 65 65 mW
TSD Thermal shutdown temperature 175 175 °C
THYS Thermal shutdown hysteresis 5 5 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.