JAJSH69D January   2018  – June 2022 TCAN4550-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specification
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC ESD and ISO Transient Specification
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Supply Characteristics
    7. 6.7  Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  VSUP Pin
      2. 8.3.2  VIO Pin
      3. 8.3.3  VCCOUT Pin
      4. 8.3.4  GND
      5. 8.3.5  INH Pin
      6. 8.3.6  WAKE Pin
      7. 8.3.7  FLTR Pin
      8. 8.3.8  RST Pin
      9. 8.3.9  OSC1 and OSC2 Pins
      10. 8.3.10 nWKRQ Pin
      11. 8.3.11 nINT Interrupt Pin
      12. 8.3.12 GPIO1 Pin
      13. 8.3.13 GPO2 Pin
      14. 8.3.14 CANH and CANL Bus Pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Sleep Mode
        1. 8.4.3.1 Bus Wake via RXD_INT Request (BWRR) in Sleep Mode
        2. 8.4.3.2 Local Wake-Up (LWU) via WAKE Input Terminal
      4. 8.4.4 Test Mode
      5. 8.4.5 Failsafe Feature
      6. 8.4.6 Protection Features
        1. 8.4.6.1 Watchdog Function
        2. 8.4.6.2 Driver and Receiver Function
        3. 8.4.6.3 Floating Terminals
        4. 8.4.6.4 TXD_INT Dominant Timeout (DTO)
        5. 8.4.6.5 CAN Bus Short Circuit Current Limiting
        6. 8.4.6.6 Thermal Shutdown
        7. 8.4.6.7 Under-Voltage Lockout (UVLO) and Unpowered Device
          1. 8.4.6.7.1 UVSUP and UVCCOUT
          2. 8.4.6.7.2 UVIO
          3. 8.4.6.7.3 Fault and M_CAN Core Behavior:
      7. 8.4.7 CAN FD
    5. 8.5 Programming
      1. 8.5.1 SPI Communication
        1. 8.5.1.1 Chip Select Not (nCS):
        2. 8.5.1.2 SPI Clock Input (SCLK):
        3. 8.5.1.3 SPI Data Input (SDI):
        4. 8.5.1.4 SPI Data Output (SDO):
      2. 8.5.2 Register Descriptions
    6. 8.6 Register Maps
      1. 8.6.1 Device ID and Interrupt/Diagnostic Flag Registers: 16'h0000 to 16'h002F
        1. 8.6.1.1 DEVICE_ID1[31:0] (address = h0000) [reset = h4E414354]
        2. 8.6.1.2 DEVICE_ID2[31:0] (address = h0004) [reset = h30353534]
        3. 8.6.1.3 Revision (address = h0008) [reset = h00110201]
        4. 8.6.1.4 Status (address = h000C) [reset = h0000000U]
        5. 8.6.1.5 SPI Error status mask (address = h0010) [reset = h00000000]
      2. 8.6.2 Device Configuration Registers: 16'h0800 to 16'h08FF
        1. 8.6.2.1 Modes of Operation and Pin Configuration Registers (address = h0800) [reset = hC8000468]
        2. 8.6.2.2 Timestamp Prescaler (address = h0804) [reset = h00000002]
        3. 8.6.2.3 Test Register and Scratch Pad (address = h0808) [reset = h00000000]
        4. 8.6.2.4 Test Register (address = h080C) [reset = h00000000]
      3. 8.6.3 Interrupt/Diagnostic Flag and Enable Flag Registers: 16'h0820/0824 and 16'h0830
        1. 8.6.3.1 Interrupts (address = h0820) [reset = h00100000]
        2. 8.6.3.2 MCAN Interrupts (address = h0824) [reset = h00000000]
        3. 8.6.3.3 Interrupt Enables (address = h0830 ) [reset = hFFFFFFFF]
      4. 8.6.4 CAN FD Register Set: 16'h1000 to 16'h10FF
        1. 8.6.4.1  Core Release Register (address = h1000) [reset = hrrrddddd]
        2. 8.6.4.2  Endian Register (address = h1004) [reset = h87654321]
        3. 8.6.4.3  Customer Register (address = h1008) [reset = h00000000]
        4. 8.6.4.4  Data Bit Timing & Prescaler (address = h100C) [reset = h0000A33]
        5. 8.6.4.5  Test Register (address = h1010 ) [reset = h00000000]
        6. 8.6.4.6  RAM Watchdog (address = h1014) [reset = h00000000]
        7. 8.6.4.7  Control Register (address = h1018) [reset = 0000 0019]
        8. 8.6.4.8  Nominal Bit Timing & Prescaler Register (address = h101C) [reset = h06000A03]
        9. 8.6.4.9  Timestamp Counter Configuration (address = h1020) [reset = h00000000]
        10. 8.6.4.10 Timestamp Counter Value (address = h1024) [reset = h00000000]
        11. 8.6.4.11 Timeout Counter Configuration (address = h1028) [reset = hFFFF0000]
        12. 8.6.4.12 Timeout Counter Value (address = h102C) [reset = h0000FFFF]
        13. 8.6.4.13 Reserved (address = h1030 - h103C) [reset = h00000000]
        14. 8.6.4.14 Error Counter Register (address = h1040) [reset = h00000000]
        15. 8.6.4.15 Protocol Status Register (address = h1044) [reset = h00000707]
        16. 8.6.4.16 Transmitter Delay Compensation Register (address = h1048) [reset = h00000000]
        17. 8.6.4.17 Reserved (address = h104C) [reset = h00000000]
        18. 8.6.4.18 Interrupt Register (address = h1050) [reset = h00000000]
        19. 8.6.4.19 Interrupt Enable (address = h1054) [reset = h00000000]
        20. 8.6.4.20 Interrupt Line Select (address = h1058) [reset = h00000000]
        21. 8.6.4.21 Interrupt Line Enable (address = h105C) [reset = h00000000]
        22. 8.6.4.22 Reserved (address = h1060 - h107C) [reset = h00000000]
        23. 8.6.4.23 Global Filter Configuration (address = h1080) [reset = h00000000]
        24. 8.6.4.24 Standard ID Filter Configuration (address = h1084) [reset = h00000000]
        25. 8.6.4.25 Extended ID Filter Configuration (address = h1088) [reset = h00000000]
        26. 8.6.4.26 Reserved (address = h108C) [reset = h00000000]
        27. 8.6.4.27 Extended ID AND Mask (address = h1090) [reset = h1FFFFFFF]
        28. 8.6.4.28 High Priority Message Status (address = h1094) [reset = h00000000]
        29. 8.6.4.29 New Data 1 (address = h1098) [reset = h00000000]
        30. 8.6.4.30 New Data 2 (address = h109C) [reset = h00000000]
        31. 8.6.4.31 Rx FIFO 0 Configuration (address = h10A0) [reset = h00000000]
        32. 8.6.4.32 Rx FIFO 0 Status (address = h10A4) [reset = h00000000]
        33. 8.6.4.33 Rx FIFO 0 Acknowledge (address = h10A8) [reset = h00000000]
        34. 8.6.4.34 Rx Buffer Configuration (address = h10AC) [reset = h00000000]
        35. 8.6.4.35 Rx FIFO 1 Configuration (address = h10B0) [reset = h00000000]
        36. 8.6.4.36 Rx FIFO 1 Status (address = h10B4) [reset = h00000000]
        37. 8.6.4.37 Rx FIFO 1 Acknowledge (address = h10B8) [reset = h00000000]
        38. 8.6.4.38 Rx Buffer/FIFO Element Size Configuration (address = h10BC) [reset = h00000000]
        39. 8.6.4.39 Tx Buffer Configuration (address = h10C0) [reset = h00000000]
        40. 8.6.4.40 Tx FIFO/Queue Status (address = h10C4) [reset = h00000000]
        41. 8.6.4.41 Tx Buffer Element Size Configuration (address = h10C8) [reset = h00000000]
        42. 8.6.4.42 Tx Buffer Request Pending (address = h10CC) [reset = h00000000]
        43. 8.6.4.43 Tx Buffer Add Request (address = h10D0) [reset = h00000000]
          1. 8.6.4.43.1  Tx Buffer Cancellation Request (address = h10D4 [reset = h00000000]
          2. 8.6.4.43.2  Tx Buffer Add Request Transmission Occurred (address = h10D8) [reset = h00000000]
          3. 8.6.4.43.3  Tx Buffer Cancellation Finished (address = h10DC) [reset = h00000000]
          4. 8.6.4.43.4  Tx Buffer Transmission Interrupt Enable (address = h10E0) [reset = h00000000]
          5. 8.6.4.43.5  Tx Buffer Cancellation Finished Interrupt Enable (address = h10E4) [reset = h00000000]
          6. 8.6.4.43.6  Reserved (address = h10E8) [reset = h00000000]
          7. 8.6.4.43.7  Reserved (address = h10EC) [reset = h00000000]
          8. 8.6.4.43.8  Tx Event FIFO Configuration (address = h10F0) [reset = h00000000]
          9. 8.6.4.43.9  Tx Event FIFO Status (address = h10F4) [reset = h00000000]
          10. 8.6.4.43.10 Tx Event FIFO Acknowledge (address = h10F8) [reset = h00000000]
          11. 8.6.4.43.11 Reserved (address = h10FC) [reset = h00000000]
  9. 9 Application and Implementation
    1. 9.1 Application Design Consideration
      1. 9.1.1 Crystal and Clock Input Requirements
      2. 9.1.2 Bus Loading, Length and Number of Nodes
      3. 9.1.3 CAN Termination
        1.       Termination
        2. 9.1.3.1 CAN Bus Biasing
      4. 9.1.4 INH Brownout Behavior
    2. 9.2 Typical Application
      1. 9.2.1 Detailed Requirements
      2. 9.2.2 Detailed Design Procedures
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
        1. 12.1.1.1 CAN Transceiver Physical Layer Standards:
        2. 12.1.1.2 EMC requirements:
        3. 12.1.1.3 Conformance Test requirements:
        4. 12.1.1.4 Support Documents
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

Figure 5-1 RGY Package
20 Pin (VQFN)
(Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 OSC1 I/O External crystal oscillator output or single-ended clock input
2 nWKRQ DO Wake request (active low)
3 GPIO1 DI/O Configurable input/output function pin through SPI
4 SCLK DI SPI clock input
5 SDI DI SPI target data input from controller output
6 SDO DO SPI target data output to controller input
7 nCS DI SPI chip select
8 nINT DO Interrupt pin to MCU (active low)
9 GPO2 DO Configurable output function pin through SPI
10 CANL HV Bus I/O Low level CAN bus line
11 CANH HV Bus I/O High level CAN bus line
12 WAKE HVI Wake input, high voltage input
13 GND GND Ground connection
14 VSUP HV Supply In Supply from battery
15 INH HVO Inhibit to control system voltage regulators and supplies (open drain)
16 VCCOUT Supply Out 5 V regulated output
17 VIO Supply In Digital I/O voltage supply
18 FLTR — Internal regulator filter, requires external capacitor to ground
19 RST DI Device reset
20 OSC2 I External crystal oscillator input; when using single-ended input clock to OSC1 this pin should be connected to ground.
(1) Note: DI = Digital Input; DO = Digital Output; HV = High Voltage; Thermal PAD and GND Pins must be soldered to GND