SPRSP96A March   2024  – September 2024 TDA4AEN-Q1 , TDA4VEN-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Terminal Configuration and Functions
    1. 5.1 Pin Diagrams
    2. 5.2 Pin Attributes
      1.      10
      2.      11
    3. 5.3 Signal Descriptions
      1.      13
      2. 5.3.1  CPSW3G
        1. 5.3.1.1 MAIN Domain
          1.        16
          2.        17
          3.        18
          4.        19
      3. 5.3.2  CPTS
        1. 5.3.2.1 MAIN Domain
          1.        22
      4. 5.3.3  CSI-2
        1. 5.3.3.1 MAIN Domain
          1.        25
          2.        26
          3.        27
          4.        28
      5. 5.3.4  DDRSS
        1. 5.3.4.1 MAIN Domain
          1.        31
      6. 5.3.5  DSI
        1. 5.3.5.1 MAIN Domain
          1.        34
      7. 5.3.6  DSS
        1. 5.3.6.1 MAIN Domain
          1.        37
      8. 5.3.7  ECAP
        1. 5.3.7.1 MAIN Domain
          1.        40
          2.        41
          3.        42
      9. 5.3.8  Emulation and Debug
        1. 5.3.8.1 MAIN Domain
          1.        45
        2. 5.3.8.2 MCU Domain
          1.        47
      10. 5.3.9  EPWM
        1. 5.3.9.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
      11. 5.3.10 EQEP
        1. 5.3.10.1 MAIN Domain
          1.        56
          2.        57
          3.        58
      12. 5.3.11 GPIO
        1. 5.3.11.1 MAIN Domain
          1.        61
          2.        62
        2. 5.3.11.2 MCU Domain
          1.        64
      13. 5.3.12 GPMC
        1. 5.3.12.1 MAIN Domain
          1.        67
      14. 5.3.13 I2C
        1. 5.3.13.1 MAIN Domain
          1.        70
          2.        71
          3.        72
          4.        73
          5.        74
        2. 5.3.13.2 MCU Domain
          1.        76
        3. 5.3.13.3 WKUP Domain
          1.        78
      15. 5.3.14 MCAN
        1. 5.3.14.1 MAIN Domain
          1.        81
          2.        82
        2. 5.3.14.2 MCU Domain
          1.        84
          2.        85
      16. 5.3.15 MCASP
        1. 5.3.15.1 MAIN Domain
          1.        88
          2.        89
          3.        90
          4.        91
          5.        92
      17. 5.3.16 MCSPI
        1. 5.3.16.1 MAIN Domain
          1.        95
          2.        96
          3.        97
        2. 5.3.16.2 MCU Domain
          1.        99
          2.        100
      18. 5.3.17 MDIO
        1. 5.3.17.1 MAIN Domain
          1.        103
      19. 5.3.18 MMC
        1. 5.3.18.1 MAIN Domain
          1.        106
          2.        107
          3.        108
      20. 5.3.19 OLDI
        1. 5.3.19.1 MAIN Domain
          1.        111
      21. 5.3.20 OSPI
        1. 5.3.20.1 MAIN Domain
          1.        114
      22. 5.3.21 Power Supply
        1.       116
      23. 5.3.22 Reserved
        1.       118
      24. 5.3.23 SERDES
        1. 5.3.23.1 MAIN Domain
          1.        121
          2.        122
          3.        123
      25. 5.3.24 System and Miscellaneous
        1. 5.3.24.1 Boot Mode Configuration
          1. 5.3.24.1.1 MAIN Domain
            1.         127
        2. 5.3.24.2 Clock
          1. 5.3.24.2.1 MCU Domain
            1.         130
          2. 5.3.24.2.2 WKUP Domain
            1.         132
        3. 5.3.24.3 System
          1. 5.3.24.3.1 MAIN Domain
            1.         135
          2. 5.3.24.3.2 MCU Domain
            1.         137
          3. 5.3.24.3.3 WKUP Domain
            1.         139
        4. 5.3.24.4 VMON
          1.        141
      26. 5.3.25 TIMER
        1. 5.3.25.1 MAIN Domain
          1.        144
        2. 5.3.25.2 MCU Domain
          1.        146
        3. 5.3.25.3 WKUP Domain
          1.        148
      27. 5.3.26 UART
        1. 5.3.26.1 MAIN Domain
          1.        151
          2.        152
          3.        153
          4.        154
          5.        155
          6.        156
          7.        157
        2. 5.3.26.2 MCU Domain
          1.        159
        3. 5.3.26.3 WKUP Domain
          1.        161
      28. 5.3.27 USB
        1. 5.3.27.1 MAIN Domain
          1.        164
          2.        165
    4. 5.4 Pin Connectivity Requirements
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings for AEC - Q100 Qualified Devices in the AMW Package
    3. 6.3 Power-On Hours (POH)
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Operating Performance Points
    6. 6.6 Electrical Characteristics
      1. 6.6.1 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 6.6.2 Fail-Safe Reset (FS RESET) Electrical Characteristics
      3. 6.6.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 6.6.4 Low-Frequency Oscillator (LFXOSC) Electrical Characteristics
      5. 6.6.5 SDIO Electrical Characteristics
      6. 6.6.6 LVCMOS Electrical Characteristics
      7. 6.6.7 CSI-2 (D-PHY) Electrical Characteristics
      8. 6.6.8 USB2PHY Electrical Characteristics
      9. 6.6.9 DDR Electrical Characteristics
    7. 6.7 VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 6.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 6.7.2 Hardware Requirements
      3. 6.7.3 Programming Sequence
      4. 6.7.4 Impact to Your Hardware Warranty
    8. 6.8 Thermal Resistance Characteristics
      1. 6.8.1 Thermal Resistance Characteristics for AMW Package TBD
    9. 6.9 Timing and Switching Characteristics
      1. 6.9.1 Timing Parameters and Information
      2. 6.9.2 Power Supply Requirements
        1. 6.9.2.1 Power Supply Slew Rate Requirement
        2. 6.9.2.2 Power Supply Sequencing
          1. 6.9.2.2.1 Power-Up Sequencing
          2. 6.9.2.2.2 Power-Down Sequencing
          3. 6.9.2.2.3 Partial IO Power Sequencing
      3. 6.9.3 System Timing
        1. 6.9.3.1 Reset Timing
        2. 6.9.3.2 Error Signal Timing
        3. 6.9.3.3 Clock Timing
      4. 6.9.4 Clock Specifications
        1. 6.9.4.1 Input Clocks / Oscillators
          1. 6.9.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 6.9.4.1.1.1 Load Capacitance
            2. 6.9.4.1.1.2 Shunt Capacitance
          2. 6.9.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
          3. 6.9.4.1.3 WKUP_LFOSC0 Internal Oscillator Clock Source
          4. 6.9.4.1.4 WKUP_LFOSC0 LVCMOS Digital Clock Source
          5. 6.9.4.1.5 WKUP_LFOSC0 Not Used
        2. 6.9.4.2 Output Clocks
        3. 6.9.4.3 PLLs
        4. 6.9.4.4 Recommended System Precautions for Clock and Control Signal Transitions
      5. 6.9.5 Peripherals
        1. 6.9.5.1  ATL
          1. 6.9.5.1.1 ATL_PCLK Timing Requirements
          2. 6.9.5.1.2 ATL_AWS[x] Timing Requirements
          3. 6.9.5.1.3 ATL_BWS[x] Timing Requirements
          4. 6.9.5.1.4 ATCLK[x] Switching Characteristics
        2. 6.9.5.2  CPSW3G
          1. 6.9.5.2.1 CPSW3G MDIO Timing
          2. 6.9.5.2.2 CPSW3G RMII Timing
          3. 6.9.5.2.3 CPSW3G RGMII Timing
        3. 6.9.5.3  CPTS
        4. 6.9.5.4  CSI-2
        5. 6.9.5.5  CSI-2 TX
        6. 6.9.5.6  DDRSS
        7. 6.9.5.7  DSS
        8. 6.9.5.8  ECAP
        9. 6.9.5.9  Emulation and Debug
          1. 6.9.5.9.1 Trace
          2. 6.9.5.9.2 JTAG
        10. 6.9.5.10 EPWM
        11. 6.9.5.11 EQEP
        12. 6.9.5.12 GPIO
        13. 6.9.5.13 GPMC
          1. 6.9.5.13.1 GPMC and NOR Flash — Synchronous Mode
          2. 6.9.5.13.2 GPMC and NOR Flash — Asynchronous Mode
          3. 6.9.5.13.3 GPMC and NAND Flash — Asynchronous Mode
        14. 6.9.5.14 I2C
        15. 6.9.5.15 MCAN
        16. 6.9.5.16 MCASP
        17. 6.9.5.17 MCSPI
          1. 6.9.5.17.1 MCSPI — Controller Mode
          2. 6.9.5.17.2 MCSPI — Peripheral Mode
        18. 6.9.5.18 MMCSD
          1. 6.9.5.18.1 MMC0 - eMMC Interface
            1. 6.9.5.18.1.1  Legacy SDR Mode
            2. 6.9.5.18.1.2  High Speed SDR Mode
            3. 6.9.5.18.1.3  High Speed DDR Mode
            4. 6.9.5.18.1.4  HS200 Mode
            5. 6.9.5.18.1.5  HS400 Mode
            6. 6.9.5.18.1.6  UHS–I SDR12 Mode
            7. 6.9.5.18.1.7  UHS–I SDR25 Mode
            8. 6.9.5.18.1.8  UHS–I SDR50 Mode
            9. 6.9.5.18.1.9  UHS–I DDR50 Mode
            10. 6.9.5.18.1.10 UHS–I SDR104 Mode
          2. 6.9.5.18.2 MMC1/MMC2 - SD/SDIO Interface
            1. 6.9.5.18.2.1 Default Speed Mode
            2. 6.9.5.18.2.2 High Speed Mode
            3. 6.9.5.18.2.3 UHS–I SDR12 Mode
            4. 6.9.5.18.2.4 UHS–I SDR25 Mode
            5. 6.9.5.18.2.5 UHS–I SDR50 Mode
            6. 6.9.5.18.2.6 UHS–I DDR50 Mode
            7. 6.9.5.18.2.7 UHS–I SDR104 Mode
        19. 6.9.5.19 OSPI
          1. 6.9.5.19.1 OSPI0 PHY Mode
            1. 6.9.5.19.1.1 OSPI0 With PHY Data Training
            2. 6.9.5.19.1.2 OSPI0 Without Data Training
              1. 6.9.5.19.1.2.1 OSPI0 PHY SDR Timing
              2. 6.9.5.19.1.2.2 OSPI0 PHY DDR Timing
          2. 6.9.5.19.2 OSPI0 Tap Mode
            1. 6.9.5.19.2.1 OSPI0 Tap SDR Timing
            2. 6.9.5.19.2.2 OSPI0 Tap DDR Timing
        20. 6.9.5.20 PCIe
        21. 6.9.5.21 Timers
        22. 6.9.5.22 UART
        23. 6.9.5.23 USB
  8. 7 Detailed Description
    1. 7.1 Overview
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG, EMU, and TRACE
      4. 8.1.4 Unused Pins
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI/QSPI/SPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback, Internal PHY Loopback, and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal SPI devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
    3. 8.3 Clock Routing Guidelines
      1. 8.3.1 Oscillator Routing
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • AMW|594
サーマルパッド・メカニカル・データ
発注情報

9.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, TDA4VENxTBD). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

For orderable part numbers of TDA4VEN/TDA4AEN devices in the AMWpackage type, see the Package Option Addendum of this document, the TI website (ti.com), or contact your TI sales representative.