JAJSPJ8A december   2022  – august 2023 TDA4AL-Q1 , TDA4VE-Q1 , TDA4VL-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
    1. 3.1 機能ブロック図
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
      2.      12
    3. 6.3 Signal Descriptions
      1.      14
      2. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
          1.        17
          2.        18
          3.        19
      3. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
          1.        22
          2.        23
      4. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
          1.        26
        2. 6.3.3.2 WKUP Domain
          1.        28
      5. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
          1.        31
          2.        32
          3.        33
          4.        34
          5.        35
          6.        36
          7.        37
        2. 6.3.4.2 MCU Domain
          1.        39
          2.        40
        3. 6.3.4.3 WKUP Domain
          1.        42
      6. 6.3.5  I3C
        1. 6.3.5.1 MCU Domain
          1.        45
      7. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
          1.        48
          2.        49
          3.        50
          4.        51
          5.        52
          6.        53
          7.        54
          8.        55
          9.        56
          10.        57
          11.        58
          12.        59
          13.        60
          14.        61
          15.        62
          16.        63
          17.        64
          18.        65
        2. 6.3.6.2 MCU Domain
          1.        67
          2.        68
      8. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
          1.        71
          2.        72
          3.        73
          4.        74
          5.        75
          6.        76
          7.        77
        2. 6.3.7.2 MCU Domain
          1.        79
          2.        80
      9. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
          1.        83
          2.        84
          3.        85
          4.        86
          5.        87
          6.        88
          7.        89
          8.        90
          9.        91
          10.        92
        2. 6.3.8.2 MCU Domain
          1.        94
        3. 6.3.8.3 WKUP Domain
          1.        96
      10. 6.3.9  MDIO
        1. 6.3.9.1 MAIN Domain
          1.        99
        2. 6.3.9.2 MCU Domain
          1.        101
      11. 6.3.10 CPSW2G
        1. 6.3.10.1 MAIN Domain
          1.        104
        2. 6.3.10.2 MCU Domain
          1.        106
      12. 6.3.11 ECAP
        1. 6.3.11.1 MAIN Domain
          1.        109
          2.        110
          3.        111
      13. 6.3.12 EQEP
        1. 6.3.12.1 MAIN Domain
          1.        114
          2.        115
          3.        116
      14. 6.3.13 EPWM
        1. 6.3.13.1 MAIN Domain
          1.        119
          2.        120
          3.        121
          4.        122
          5.        123
          6.        124
          7.        125
      15. 6.3.14 USB
        1. 6.3.14.1 MAIN Domain
          1.        128
      16. 6.3.15 Display Port
        1. 6.3.15.1 MAIN Domain
          1.        131
      17. 6.3.16 Hyperlink
        1. 6.3.16.1 MAIN Domain
          1.        134
          2.        135
          3.        136
      18. 6.3.17 PCIE
        1. 6.3.17.1 MAIN Domain
          1.        139
      19. 6.3.18 SERDES
        1. 6.3.18.1 MAIN Domain
          1.        142
      20. 6.3.19 DSI
        1. 6.3.19.1 MAIN Domain
          1.        145
          2.        146
      21. 6.3.20 CSI
        1. 6.3.20.1 MAIN Domain
          1.        149
          2.        150
      22. 6.3.21 MCASP
        1. 6.3.21.1 MAIN Domain
          1.        153
          2.        154
          3.        155
          4.        156
          5.        157
      23. 6.3.22 DMTIMER
        1. 6.3.22.1 MAIN Domain
          1.        160
        2. 6.3.22.2 MCU Domain
          1.        162
      24. 6.3.23 CPTS
        1. 6.3.23.1 MAIN Domain
          1.        165
        2. 6.3.23.2 MCU Domain
          1.        167
      25. 6.3.24 DSS
        1. 6.3.24.1 MAIN Domain
          1.        170
      26. 6.3.25 GPMC
        1. 6.3.25.1 MAIN Domain
          1.        173
      27. 6.3.26 MMC
        1. 6.3.26.1 MAIN Domain
          1.        176
          2.        177
      28. 6.3.27 OSPI
        1. 6.3.27.1 MCU Domain
          1.        180
          2.        181
      29. 6.3.28 Hyperbus
        1. 6.3.28.1 MCU Domain
          1.        184
      30. 6.3.29 Emulation and Debug
        1. 6.3.29.1 MAIN Domain
          1.        187
          2.        188
      31. 6.3.30 System and Miscellaneous
        1. 6.3.30.1 Boot Mode configuration
          1.        191
        2. 6.3.30.2 Clock
          1.        193
          2.        194
        3. 6.3.30.3 System
          1.        196
          2.        197
        4. 6.3.30.4 EFUSE
          1.        199
        5. 6.3.30.5 VMON
          1.        201
      32. 6.3.31 Power
        1.       203
    4. 6.4 Connection for Unused Pins
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power-On-Hour (POH) Limits
    5. 7.5  Operating Performance Points
    6. 7.6  Electrical Characteristics
      1. 7.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 7.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 7.6.4  eMMCPHY Electrical Characteristics
      5. 7.6.5  SDIO Electrical Characteristics
      6. 7.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 7.6.7  ADC12B Electrical Characteristics
      8. 7.6.8  LVCMOS Electrical Characteristics
      9. 7.6.9  USB2PHY Electrical Characteristics
      10. 7.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 7.6.11 UFS M-PHY Electrical Characteristics
      12. 7.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 7.6.13 DDR0 Electrical Characteristics
    7. 7.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.7.2 Hardware Requirements
      3. 7.7.3 Programming Sequence
      4. 7.7.4 Impact to Your Hardware Warranty
    8. 7.8  Thermal Resistance Characteristics
      1. 7.8.1 Thermal Resistance Characteristics for ALZ Package
    9. 7.9  Temperature Sensor Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 7.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 7.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing
        6. 7.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 7.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 7.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input and Output Clocks / Oscillators
          1. 7.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.10.4.1.3.1 Load Capacitance
            2. 7.10.4.1.3.2 Shunt Capacitance
          4. 7.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.10.4.1.5 Auxiliary OSC1 Not Used
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Module and Peripheral Clocks Frequencies
      5. 7.10.5 Peripherals
        1. 7.10.5.1  ATL
          1. 7.10.5.1.1 ATL_PCLK Timing Requirements
          2. 7.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.10.5.2  CPSW2G
          1. 7.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 7.10.5.2.2 CPSW2G RMII Timings
            1. 7.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 7.10.5.2.3 CPSW2G RGMII Timings
            1. 7.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 7.10.5.3  CSI-2
        4. 7.10.5.4  DDRSS
        5. 7.10.5.5  DSS
        6. 7.10.5.6  eCAP
          1. 7.10.5.6.1 Timing Requirements for eCAP
          2. 7.10.5.6.2 Switching Characteristics for eCAP
        7. 7.10.5.7  EPWM
          1. 7.10.5.7.1 Timing Requirements for eHRPWM
          2. 7.10.5.7.2 Switching Characteristics for eHRPWM
        8. 7.10.5.8  eQEP
          1. 7.10.5.8.1 Timing Requirements for eQEP
          2. 7.10.5.8.2 Switching Characteristics for eQEP
        9. 7.10.5.9  GPIO
          1. 7.10.5.9.1 GPIO Timing Requirements
          2. 7.10.5.9.2 GPIO Switching Characteristics
        10. 7.10.5.10 GPMC
          1. 7.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 7.10.5.10.4 GPMC0 IOSET
        11. 7.10.5.11 HyperBus
          1. 7.10.5.11.1 Timing Requirements for HyperBus
          2. 7.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 7.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 7.10.5.12 I2C
        13. 7.10.5.13 I3C
        14. 7.10.5.14 MCAN
        15. 7.10.5.15 MCASP
        16. 7.10.5.16 MCSPI
          1. 7.10.5.16.1 MCSPI — Controller Mode
          2. 7.10.5.16.2 MCSPI — Peripheral Mode
        17. 7.10.5.17 MMCSD
          1. 7.10.5.17.1 MMC0 - eMMC Interface
            1. 7.10.5.17.1.1 Legacy SDR Mode
            2. 7.10.5.17.1.2 High Speed SDR Mode
            3. 7.10.5.17.1.3 High Speed DDR Mode
            4. 7.10.5.17.1.4 HS200 Mode
            5. 7.10.5.17.1.5 HS400 Mode
          2. 7.10.5.17.2 MMC1/2 - SD/SDIO Interface
            1. 7.10.5.17.2.1 Default Speed Mode
            2. 7.10.5.17.2.2 High Speed Mode
            3. 7.10.5.17.2.3 UHS–I SDR12 Mode
            4. 7.10.5.17.2.4 UHS–I SDR25 Mode
            5. 7.10.5.17.2.5 UHS–I SDR50 Mode
            6. 7.10.5.17.2.6 UHS–I DDR50 Mode
            7. 7.10.5.17.2.7 UHS–I SDR104 Mode
        18. 7.10.5.18 CPTS
          1. 7.10.5.18.1 CPTS Timing Requirements
          2. 7.10.5.18.2 CPTS Switching Characteristics
        19. 7.10.5.19 OSPI
          1. 7.10.5.19.1 OSPI0 PHY Mode
            1. 7.10.5.19.1.1 OSPI With Data Training
              1. 7.10.5.19.1.1.1 OSPI Switching Characteristics – Data Training
            2. 7.10.5.19.1.2 OSPI Without Data Training
              1. 7.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 7.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 7.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 7.10.5.19.1.2.4 OSPI Switching Characteristics – DDR Mode
          2. 7.10.5.19.2 OSPI0 Tap Mode
            1. 7.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 7.10.5.20 PCIE
        21. 7.10.5.21 Timers
          1. 7.10.5.21.1 Timing Requirements for Timers
          2. 7.10.5.21.2 Switching Characteristics for Timers
        22. 7.10.5.22 UART
          1. 7.10.5.22.1 Timing Requirements for UART
          2. 7.10.5.22.2 UART Switching Characteristics
        23. 7.10.5.23 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
          1. 7.10.6.2.1 JTAG Electrical Data and Timing
            1. 7.10.6.2.1.1 JTAG Timing Requirements
            2. 7.10.6.2.1.2 JTAG Switching Characteristics
  9. 8 Applications, Implementation, and Layout
    1. 8.1 Device Connection and Layout Fundamentals
      1. 8.1.1 Power Supply Decoupling and Bulk Capacitors
        1. 8.1.1.1 Power Distribution Network Implementation Guidance
      2. 8.1.2 External Oscillator
      3. 8.1.3 JTAG and EMU
      4. 8.1.4 Reset
      5. 8.1.5 Unused Pins
      6. 8.1.6 Hardware Design Guide for JacintoTM 7 Devices
    2. 8.2 Peripheral- and Interface-Specific Design Information
      1. 8.2.1 LPDDR4 Board Design and Layout Guidelines
      2. 8.2.2 OSPI and QSPI Board Design and Layout Guidelines
        1. 8.2.2.1 No Loopback and Internal Pad Loopback
        2. 8.2.2.2 External Board Loopback
        3. 8.2.2.3 DQS (only available in Octal Flash devices)
      3. 8.2.3 USB VBUS Design Guidelines
      4. 8.2.4 System Power Supply Monitor Design Guidelines using VMON/POK
      5. 8.2.5 High Speed Differential Signal Routing Guidance
      6. 8.2.6 Thermal Solution Guidance
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
      1. 9.1.1 Standard Package Symbolization
      2. 9.1.2 Device Naming Convention
    2. 9.2 Tools and Software
    3. 9.3 Documentation Support
    4. 9.4 Trademarks
    5. 9.5 サポート・リソース
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ALZ|770
サーマルパッド・メカニカル・データ
発注情報

7.8.1 Thermal Resistance Characteristics for ALZ Package

It is recommended to perform thermal simulations at the system level with the worst case device power consumption.
NO.PARAMETERDESCRIPTIONALZ PACKAGE
°C/W(1)(3)AIR FLOW
(m/s)(2)
T1RΘJCJunction-to-case0.3N/A
T2RΘJBJunction-to-board2.0N/A
T3RΘJAJunction-to-free air10.40
T4Junction-to-moving air6.11
T55.32
T64.83
T7ΨJTJunction-to-package top0.160
T80.171
T90.172
T100.173
T11ΨJBJunction-to-board1.80
T121.51
T131.42
T141.43
(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards:
  • JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)
  • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)
  • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
  • JESD51-9, Test Boards for Area Array Surface Mount Packages
(2) m/s = meters per second.
(3) °C/W = degrees Celsius per watt.