SLOS217I July   1998  – December 2024 THS3001

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Feedback and Gain Resistor Values
      2. 7.1.2 Noise Calculations
      3. 7.1.3 Slew Rate
      4. 7.1.4 Offset Voltage
    2. 7.2 Typical Applications
      1. 7.2.1 General Configurations
      2. 7.2.2 Driving a Capacitive Load
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Design Considerations
        2. 7.4.1.2 Thermal Considerations
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Evaluation Board
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • D|8
  • DGN|8
サーマルパッド・メカニカル・データ
発注情報

Description

The THS3001 is a high-speed, current-feedback operational amplifier, designed for communication, imaging, and high-quality video applications. This device offers a very fast 6500V/μs slew rate, a 420MHz bandwidth, and a 40ns settling time for large-signal applications requiring excellent transient response. In addition, the THS3001 operates with a very low distortion of –96dBc, making this device an excellent choice for applications such as wireless communication base stations or ultra-fast ADC or DAC buffers.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
THS3001 D (SOIC, 8) 4.9mm × 6mm
DGN (HVSSOP, 8) 3mm × 4.9mm
For more information, Section 10.
The package size (length × width) is a nominal value and includes pins, where applicable.
Related Devices
THS4011THS4012 290MHz VFB high-speed amplifier
THS6012 500mA CFB high-speed amplifier
THS6022 250mA CFB high-speed amplifier
THS3001 Harmonic Distortion vs FrequencyHarmonic Distortion vs Frequency
THS3001 Output Amplitude vs FrequencyOutput Amplitude vs Frequency