SLOS217I July 1998 – December 2024 THS3001
PRODUCTION DATA
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
THERMAL METRIC(1) | THS3001 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DGN (HVSSOP) | |||
8 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 97.5 | 56.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 38.3 | 78.2 | °C/W |
RθJB | Junction-to-board thermal resistance | N/A | 29.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | N/A | 4.7 | °C/W |
ΨJB | Junction-to-board characterization parameter | N/A | 29.5 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 12.5 | °C/W |