SBOS766B February   2016  – February 2016 THS3217

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: D2S
    6. 7.6  Electrical Characteristics: OPS
    7. 7.7  Electrical Characteristics: D2S + OPS
    8. 7.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 7.9  Typical Characteristics: D2S + OPS
    10. 7.10 Typical Characteristics: D2S Only
    11. 7.11 Typical Characteristics: OPS only
    12. 7.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 7.13 Typical Characteristics: Switching Performance
    14. 7.14 Typical Characteristics: Miscellaneous Performance
  8. Parameter Measurement Information
    1. 8.1 Overview
    2. 8.2 Frequency Response Measurement
    3. 8.3 Harmonic Distortion Measurement
    4. 8.4 Noise Measurement
    5. 8.5 Output Impedance Measurement
    6. 8.6 Step-Response Measurement
    7. 8.7 Feedthrough Measurement
    8. 8.8 Midscale Buffer ROUT Versus CLOAD Measurement
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2-V/V (Pins 2, 3, 6 and 14)
      2. 9.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 9.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 9.3.3.1 Output DC Offset and Drift for the OPS
        2. 9.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 9.3.3.3 Switch Feedthrough to the OPS
        4. 9.3.3.4 Driving Capacitive Loads
      4. 9.3.4 Digital Control Lines
    4. 9.4 Device Functional Modes
      1. 9.4.1 Full-Signal Path Mode
        1. 9.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 9.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 9.4.1.3 External Connection
      2. 9.4.2 Dual-Output Mode
      3. 9.4.3 Differential I/O Voltage Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Applications
        1. 10.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 High-Voltage Pulse-Generator
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 10.1.1.3.1 Design Requirements
        4. 10.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 10.1.1.4.1 Design Requirements
        5. 10.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 10.1.1.5.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Considerations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 TINA-TI (Free Software Download)
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

12 Layout

12.1 Layout Guidelines

High-speed amplifier designs require careful attention to board layout in order to achieve the performance specified in the data sheets. Poor layout techniques can lead to increased parasitics from the board and external components resulting in suboptimal performance, and also instability in the form of oscillations. The THS3217 evaluation module (EVM) serves as a good reference for proper, high-speed layout methodology. The EVM includes numerous extra elements needed for lab characterization, and also additional features that are useful in certain applications. These additional components can be eliminated on the end system if not required by the application. General suggestions for the design and layout of high-speed, signal-path solutions include:

  1. Minimize parasitic capacitance to any ac ground for all of the signal I/O pins. Parasitic capacitance on the output and input pins can cause instability. To reduce unwanted capacitance, a window around the signal I/O pins should be opened on all of the ground and power planes around those pins. On other areas of the board continuous ground and power planes are preferred for signal routing with matched impedance traces for longer runs.
  2. Use good, high-frequency decoupling capacitors (0.1 µF) on the ground plane at the device power pins. Higher value capacitors (2.2 µF) are required, but may be placed further from the device power pins and shared among devices. For best high-frequency decoupling, consider X2Y supply-decoupling capacitors that offer a much higher self-resonance frequency over standard capacitors. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling capacitors. Follow the power-supply guidelines recommended in the Power Supply Recommendations section.
  3. Careful selection and placement of external components preserve the high-frequency performance of the THS3217. Use low-reactance type resistors. Surface-mount resistors work best, and allow a tighter overall layout. Keep the printed circuit board (PCB) trace length as short as possible. Never use wire-bound type resistors in a high-frequency application. The output pin and inverting input pins are the most sensitive to parasitic capacitance; therefore, always position the feedback and series output resistors, if any, as close as possible to the inverting input pins and output pins. Place other network components, such as input termination resistors, close to the gain-setting resistors.
  4. When using differential signal routing over any appreciable distance, use microstrip layout techniques with matched impedance traces. On differential lines, like those on the D2S inputs, match the routing in order to minimize common-mode noise effects and improve HD2 performance.
  5. The input summing junction of the OPS is very sensitive to parasitic capacitance. Connect the RG element into the summing junction with minimal trace length to the device pin side of the resistor. The other side of RG can have more trace length if needed to the source or to ground. For best results, do not socket a high-speed part like the THS3217. The additional lead length and pin-to-pin capacitance introduced by the socket can create an extremely troublesome parasitic network that can make it almost impossible to achieve a smooth, stable frequency response. Best results are obtained by soldering the THS3217 directly onto the board.

12.2 Layout Example

THS3217 s12_Layout.gif Figure 107. Layout Example