SBOS766B February   2016  – February 2016 THS3217

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: D2S
    6. 7.6  Electrical Characteristics: OPS
    7. 7.7  Electrical Characteristics: D2S + OPS
    8. 7.8  Electrical Characteristics: Midscale (DC) Reference Buffer
    9. 7.9  Typical Characteristics: D2S + OPS
    10. 7.10 Typical Characteristics: D2S Only
    11. 7.11 Typical Characteristics: OPS only
    12. 7.12 Typical Characteristics: Midscale (DC) Reference Buffer
    13. 7.13 Typical Characteristics: Switching Performance
    14. 7.14 Typical Characteristics: Miscellaneous Performance
  8. 8 Parameter Measurement Information
    1. 8.1 Overview
    2. 8.2 Frequency Response Measurement
    3. 8.3 Harmonic Distortion Measurement
    4. 8.4 Noise Measurement
    5. 8.5 Output Impedance Measurement
    6. 8.6 Step-Response Measurement
    7. 8.7 Feedthrough Measurement
    8. 8.8 Midscale Buffer ROUT Versus CLOAD Measurement
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Differential to Single-Ended Stage (D2S) With Fixed Gain of 2-V/V (Pins 2, 3, 6 and 14)
      2. 9.3.2 Midscale (DC) Reference Buffer (Pin 1 and Pin 15)
      3. 9.3.3 Output Power Stage (OPS) (Pins 4, 7, 9, 10, 11, and 12)
        1. 9.3.3.1 Output DC Offset and Drift for the OPS
        2. 9.3.3.2 OPS Harmonic Distortion (HD) Performance
        3. 9.3.3.3 Switch Feedthrough to the OPS
        4. 9.3.3.4 Driving Capacitive Loads
      4. 9.3.4 Digital Control Lines
    4. 9.4 Device Functional Modes
      1. 9.4.1 Full-Signal Path Mode
        1. 9.4.1.1 Internal Connection With Fixed Common-Mode Output Voltage
        2. 9.4.1.2 Internal Connection With Adjustable Common-Mode Output Voltage
        3. 9.4.1.3 External Connection
      2. 9.4.2 Dual-Output Mode
      3. 9.4.3 Differential I/O Voltage Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Typical Applications
        1. 10.1.1.1 High-Frequency, High-Voltage, Dual-Output Line Driver for AWGs
          1. 10.1.1.1.1 Design Requirements
          2. 10.1.1.1.2 Detailed Design Procedure
          3. 10.1.1.1.3 Application Curves
        2. 10.1.1.2 High-Voltage Pulse-Generator
          1. 10.1.1.2.1 Design Requirements
          2. 10.1.1.2.2 Detailed Design Procedure
          3. 10.1.1.2.3 Application Curves
        3. 10.1.1.3 Single-Supply, AC-Coupled, Piezo Element Driver
          1. 10.1.1.3.1 Design Requirements
        4. 10.1.1.4 Output Common-Mode Control Using the Midscale Buffer as a Level Shifter
          1. 10.1.1.4.1 Design Requirements
        5. 10.1.1.5 Differential I/O Driver With independent Common-Mode Control
          1. 10.1.1.5.1 Design Requirements
  11. 11Power Supply Recommendations
    1. 11.1 Thermal Considerations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
        1. 13.1.1.1 TINA-TI (Free Software Download)
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.