JAJSJO7E December   2002  – August 2020 THS7530

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Main Amplifier
    6. 6.6 Package Thermal Data
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Test Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Continually-Variable Gain Control
      2. 8.3.2 Common-Mode Voltage Control
      3. 8.3.3 Output Voltage Clamps
      4. 8.3.4 Power-Down Mode
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Detailed Design Procedure

The THS7530 device is designed for nominal 5-V power supply from VS+ to VS–.

The amplifier has fully differential inputs, VIN+ and VIN–, and fully differential outputs, VOUT+ and VOUT– The inputs are high impedance and outputs are low impedance. External resistors are recommended for impedance matching and termination purposes.

The inputs and outputs can be DC-coupled, but for best performance, the input and output common-mode voltage should be maintained at the midpoint between the two supply pins. The output common-mode voltage is controlled by the voltage applied to VOCM. Left unterminated, VOCM is set to midsupply by internal resistors. A 0.1-µF bypass capacitor should be placed between VOCM and ground to reduce common-mode noise. The input common-mode voltage defaults to midrail when left unconnected. For voltages other than midrail, VOCMmust be biased by external means. VIN+ and VIN– both require a nominal 30-µA bias current for proper operation. Therefore, ensure equal input impedance at each input to avoid generating an offset voltage that varies with gain.

Voltage applied from VG– to VG+ controls the gain of the part with 38.8-dB/V gain slope. The input can be differential or single ended. VG– must be maintained within –0.6 V and 0.8 V of VS–for proper operation. The negative gain input should typically be tied directly to the negative power supply.

VCL+ and VCL– are inputs that limit the output voltage swing of the amplifier. The voltages applied set an absolute limit on the voltages at the output. Input voltages at VCL+ and VCL– clamp the output, ensuring that neither output exceeds those values.

The power-down input is a TTL compatible input, referenced to the negative supply voltage. A logic low puts the THS7530 device in power-saving mode. In power-down mode the part consumes less than 1-mA current, the output goes high impedance, and a high amount of isolation is maintained between the input and output.

Power-supply bypass capacitors are required for proper operation. A 6.8-µF tantalum bulk capacitor is recommended if the amplifier is located far from the power supply and may be shared among other devices. A ceramic 0.1-µF capacitor is recommended within 0.1-in of the device power pin. The ceramic capacitors should be located on the same layer as the amplifier to eliminate the use of vias between the capacitors and the power pin.

Table 9-1 THS7530EVM Bill of Materials
ITEM NO.DESCRIPTIONSIZEREFERENCE DESIGNATORQTYPART NUMBER
1Bead, ferrite, 3 A, 80 Ω1206FB11(Steward) HI1206N800R–00
2Capacitor, tantalum, 6.8 mF, 35 V, 10%DC21(AVX) TAJD685K035R
3Capacitor, ceramic, 0.1 mF, X7R, 16V508C11(AVX) 0508YC104KAT2A
5Capacitor, ceramic, 0.1 mF, X7R, 50 V805C3, C7, C12, C13, C14, C15, C16, C178(AVX) 08055C104KAT2A
6Diode, Schottky, 20 V, 0.5 ASOD-123D11(Diodes Inc.) B0520LW–7
7Resistor, 10 Ω, 1/8 W, 1%805R24, R25, R263(PHYCOMP)
9C08052A10R0FKHFT
8Resistor, 24.9 Ω, 1/8 W, 1%805R9, R152(PHYCOMP)
9C08052A24R9FKHFT
9Resistor, 1 kΩ, 1.8W, 1%805R7, R122(PHYCOMP)
9C08052A1001FKHFT
10Resistor, 3.92 kΩ , 1/8 W, 1%805R11(PHYCOMP)
9C08052A3921FKHFT
11Resistor, 0 Ω, 1/4 W1206C4, C52(PHYCOMP)
9C12063A0R00JLHFT
12Resistor, 49.9 Ω, 1/4 W, 1%1206R41(PHYCOMP)
9C12063A49R9FKRFT
13Pot., ceramic, 1/4 inch square, 1 kΩR21(Bourns) 3362P–1–102
14Pot., ceramic, 1/4 inch square, 10 kΩR21, R22, R233(Bourns) 3362P–1–103
15IC, TLV2371SOT-23U2, U3, U43(TI) TLV2371IDBVT
16Transformer, 1:1CD542T1, T22(Mini-Circuits) ADT1-1WT
17Connector, edge, SMA PCB JackJ3, J42(Johnson) 142–0701–801
18Jack, banana receptacle, 0.25-in diameter holeJ1, J22(HH Smith) 101
19Header, 0.1-in Ctrs, 0.025-in square pins2 POS.JP11(Sullins) PZC36SAAN
20ShuntsJP11(Sullins) SSC02SYAN
21Test point, blackTP2, TP3, TP43(Keystone) 5001
22Test points, redTP1, TP8, TP9, TP104(Keystone) 5000
23Standoff, 4–40 Hex, 0.625-in Length4(Keystone) 1804
24Screw, Phillips, 4–40, .250-in4SHR–0440–016–SN
25IC, THS7530U11(TI) THS7530PWP
26Board, printed circuit1(TI) EDGE # 6441987