JAJSKV9B December   2020  – October 2021 THVD1400 , THVD1420

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation Characteristics
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics (THVD1400)
    9. 5.9  Switching Characteristics (THVD1420)
    10. 5.10 Typical Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Receiver Failsafe
        5. 8.2.1.5 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.5 Thermal Information

THERMAL METRIC(1) THVD1400, THVD1420 UNIT
DRL (SOT) D (SOIC)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 112.2 126.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.4 66.2 °C/W
RθJB Junction-to-board thermal resistance 22.1 69.4 °C/W
ψJT Junction-to-top characterization parameter 1.2 18.7 °C/W
ψJB Junction-to-board characterization parameter 22.0 68.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.