JAJSI45 October   2019 THVD1520

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      概略回路図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings [IEC]
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Power Dissipation Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Failsafe
        5. 9.2.1.5 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
    2. 12.2 デベロッパー・ネットワークの製品に関する免責事項
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VID Differential input voltage –12 12 V
VI Input voltage at any bus terminal(1) –7 12 V
VIH High-level input voltage (driver, driver-enable, and receiver-enable inputs) 2 VCC V
VIL Low-level input voltage (driver, driver-enable, and receiver-enable inputs) 0 0.8 V
IO Output current Driver –60 60 mA
Receiver –8 8
RL Differential load resistance 54 60 Ω
1/tUI Signaling rate 10 Mbps
TJ Junction temperature –40 150 °C
TA(2) Operating ambient temperature –40 125 °C
The algebraic convention in which the least positive (most negative) limit is designated as minimum is used in this data sheet.
Operation is specified for internal (junction) temperatures upto 150°C. Self-heating due to internal power dissipation should be considered for each application. Maximum junction temperature is internally limited by the thermal shutdown (TSD) circuit which disables the device when the junction temperature reaches 170°C.