JAJSH55A march   2019  – august 2021 TL7700-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sense-Voltage Setting
      2. 8.3.2 Sense-Voltage Hysteresis Setting
      3. 8.3.3 Output Pulse-Duration Setting
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 用語集
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision * (March 2019) to Revision A (August 2021)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • 「製品情報」表にパッケージ質量を追加し、「概要」セクションから車載アプリケーションを削除 Go
  • Removed MIN and MAX values for SENSE input current [25°C] in the Electrical Characteristics sectionGo
  • Changed MIN value for SENSE input current [–55°C to 125°C], From 1.5 μA : To 1 μA, in the Electrical Characteristics sectionGo
  • Changed MIN value for Timing-capacitor charge current [25°C], From 11 μA : To 8 μA, in the Electrical Characteristics sectionGo
  • Added more variables to the tpo equation in the Output Pulse-Duration Setting sectionGo
  • Added equations to demonstrate an example calculation in the Detailed Design Procedure sectionGo