SLVSFI5A October   2020  – December 2020 TLC6C5748-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Terminal Configurations and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Terminal-Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Circuits
    3. 7.3 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current Calculation
      2. 8.3.2 Register and Data Latch Configuration
        1. 8.3.2.1 769-Bit Common Shift Register
        2. 8.3.2.2 Grayscale (GS) Data Latch
        3. 8.3.2.3 Control Data Latch
        4. 8.3.2.4 Dot Correction (DC) Data Latch
        5. 8.3.2.5 Maximum Current (MC) Data Latch
        6. 8.3.2.6 Global Brightness Control (BC) Data Latch
        7. 8.3.2.7 Function Control (FC) Data Latch
      3. 8.3.3 Status Information Data (SID)
      4. 8.3.4 LED Open Detection (LOD)
      5. 8.3.5 LED Short Detection (LSD)
      6. 8.3.6 Thermal Shutdown Faults (TSD)
      7. 8.3.7 Noise Reduction
    4. 8.4 Device Functional Modes
      1. 8.4.1 Maximum Current Control (MC) Function
      2. 8.4.2 Dot Correction (DC) Function
      3. 8.4.3 Global Brightness Control (BC) Function
      4. 8.4.4 Grayscale (GS) Function (PWM Control)
        1. 8.4.4.1 Conventional PWM Control
        2. 8.4.4.2 Enhanced Spectrum (ES) PWM Control
        3. 8.4.4.3 Auto Display Repeat Function
        4. 8.4.4.4 Display Timing Reset Function
        5. 8.4.4.5 Auto Data Refresh Function
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Daisy-Chain Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Step-by-Step Design Procedure
          2. 9.2.1.2.2 Maximum Current (MC) Data
          3. 9.2.1.2.3 Global Brightness Control (BC) Data
          4. 9.2.1.2.4 Dot Correction (DC) Data
          5. 9.2.1.2.5 Grayscale (GS) Data
          6. 9.2.1.2.6 Other Control Data
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TLC6C5748-Q1 UNIT
HTTSOP
56-PIN
RθJA Junction-to-ambient thermal resistance(2) 32.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.8 °C/W
RθJB Junction-to-board thermal resistance 16.1 °C/W
ΨJT Junction-to-top characterization parameter 0.8 °C/W
ΨJB Junction-to-board characterization parameter 16 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.