4 Revision History
Changes from A Revision (June 2008) to B Revision
-
Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
-
Deleted 8-Pin MSOP (TLV2372) because the TLV2372-Q1 is not available in MSOP; also removed all references throughout the data sheetGo
-
Changed list items in Applications Go
-
Removed Family Package and Available Options tables, see POA at the end of the data sheet Go
-
Renamed Selection of Signal Amplifier Products table toDevice Comparison TableGo
-
Changed SHUTDOWN for the TLV237x in the Device Comparison Table From: Yes To: —Go
-
Changed IIB (pA) for the TLV246x in the Device Comparison Table From: 1300 To: 1.3Go
-
Changed SHUTDOWN for the TLV237x in the Device Comparison Table From: Yes To: —Go
-
Changed GND DESCRIPTION in Pin Functions: TLV2371-Q1 From: Ground connection To: Negative (lowest) power supplyGo
-
Changed GND DESCRIPTION in Pin Functions: TLV2372-Q1 From: Ground connection To: Negative (lowest) power supplyGo
-
Removed Typical Pin 1 Indicators image Go
-
Changed GND DESCRIPTION in Pin Functions: TLV2374-Q1 From: Ground connection To: Negative (lowest) power supplyGo
-
Deleted Lead temperature (260°C maximum)Go
-
Added additional thermal values to all Thermal Information tablesGo
-
Changed RθJA values in Thermal Information: TLV2371-Q1 From: 325.1 To: 228.5 (DBV) and From: 176 To: 138.4 (D)Go
-
Changed RθJA value in Thermal Information: TLV2372-Q1 From: 176 To: 138.4 (D)Go
-
Deleted entire DGK (MSOP) column from Thermal Information: TLV2372-Q1Go
-
Changed RθJA values in Thermal Information: TLV2374-Q1 From: 122.3 To: 67 (D) and From: 173.6 To: 121 (PW)Go
-
Deleted Maximum Power Dissipation vs Free-Air Temperature graphGo