SBOS752A February   2016  – September 2016 TLV2316 , TLV316 , TLV4316

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: TLV316
    5. 7.5 Thermal Information: TLV2316
    6. 7.6 Thermal Information: TLV4316
    7. 7.7 Electrical Characteristics
    8. 7.8 Typical Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Operating Voltage
      2. 8.3.2 Rail-to-Rail Input
      3. 8.3.3 Rail-to-Rail Output
      4. 8.3.4 Common-Mode Rejection Ratio (CMRR)
      5. 8.3.5 Capacitive Load and Stability
      6. 8.3.6 EMI Susceptibility and Input Filtering
      7. 8.3.7 Overload Recovery
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 System Examples
  10. 10Power Supply Recommendations
    1. 10.1 Input and ESD Protection
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage 7 V
Signal input pins Voltage(2) Common-mode (V–) – 0.5 (V+) + 0.5 V
Differential (V+) – (V–) + 0.2
Current(2) –10 10 mA
Output short-circuit(3) Continuous mA
Temperature Specified, TA –40 125 °C
Junction, TJ 150
Storage, Tstg –65 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Current limit input signals that can swing more than 0.5 V beyond the supply rails to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.

7.2 ESD Ratings

over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VS Supply voltage 1.8 5.5 V
Specified temperature range –40 125 °C

7.4 Thermal Information: TLV316

THERMAL METRIC(1) TLV316 UNIT
DBV (SOT-23) DCK (SC70)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 221.7 263.3 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 144.7 75.5 °C/W
RθJB Junction-to-board thermal resistance 49.7 51.0 °C/W
ψJT Junction-to-top characterization parameter 26.1 1.0 °C/W
ψJB Junction-to-board characterization parameter 49.0 50.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.5 Thermal Information: TLV2316

THERMAL METRIC(1) TLV2316 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 127.2 186.6 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 71.6 78.8 °C/W
RθJB Junction-to-board thermal resistance 68.2 107.9 °C/W
ψJT Junction-to-top characterization parameter 22.0 15.5 °C/W
ψJB Junction-to-board characterization parameter 67.6 106.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.6 Thermal Information: TLV4316

THERMAL METRIC(1) TLV4316 UNIT
PW (TSSOP) D (SOIC)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 117.2 87.0 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 46.2 44.4 °C/W
RθJB Junction-to-board thermal resistance 58.9 41.7 °C/W
ψJT Junction-to-top characterization parameter 4.9 11.6 °C/W
ψJB Junction-to-board characterization parameter 58.3 41.4 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

7.7 Electrical Characteristics

at TA = 25°C, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2 (unless otherwise noted); VS (total supply voltage) = (V+) – (V–) = 1.8 V to 5.5 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
OFFSET VOLTAGE
VOS Input offset voltage VS = 5 V ±0.75 ±3 mV
VS = 5 V, TA = –40°C to +125°C ±4.5
dVOS/dT Drift VS = 5 V, TA = –40°C to +125°C ±2 µV/°C
PSRR Power-supply rejection ratio VS = 1.8 V – 5.5 V, VCM = (V–) ±30 ±175 µV/V
Channel separation, dc At dc 100 dB
INPUT VOLTAGE RANGE
VCM Common-mode voltage range VS = 5.5 V (V–) – 0.2 (V+) + 0.2 V
CMRR Common-mode rejection ratio VS = 5.5 V, (V–) – 0.2 V < VCM < (V+) – 1.4 V,
TA = –40°C to +125°C 		72 90 dB
VS = 5.5 V, VCM = –0.2 V to 5.7 V,
TA = –40°C to +125°C 		75
INPUT BIAS CURRENT
IB Input bias current ±10 pA
IOS Input offset current ±10 pA
NOISE
En Input voltage noise (peak-to-peak) VS = 5 V, f = 0.1 Hz to 10 Hz 5 µVPP
en Input voltage noise density VS = 5 V, f = 1 kHz 12 nV/√Hz
in Input current noise density f = 1 kHz 1.3 fA/√Hz
INPUT IMPEDANCE
ZID Differential 2 || 2 1016Ω || pF
ZIC Common-mode 2 || 4 1011Ω || pF
OPEN-LOOP GAIN
AOL Open-loop voltage gain VS = 5.5 V, (V–) + 0.05 V < VO < (V+) – 0.05 V,
RL = 10 kΩ		 100 104 dB
VS = 5.5 V, (V–) + 0.15 V < VO < (V+) – 0.15 V,
RL = 2 kΩ		 104
FREQUENCY RESPONSE
GBP Gain bandwidth product VS = 5 V, G = +1 10 MHz
φm Phase margin VS = 5 V, G = +1 60 Degrees
SR Slew rate VS = 5 V, G = +1 6 V/μs
tS Settling time To 0.1%, VS = 5 V, 2-V step , G = +1, CL = 100 pF 1 μs
tOR Overload recovery time VS = 5 V, VIN  × gain = VS 0.8 μs
THD + N Total harmonic distortion + noise(1) VS = 5 V, VO = 0.5 VRMS, G = +1, f = 1 kHz 0.008%
OUTPUT
VO Voltage output swing from supply rails VS = 1.8 V to 5.5 V, RL = 10 kΩ, 35 mV
VS = 1.8 to 5.5 V, RL = 2 kΩ, 125
ISC Short-circuit current VS = 5 V ±50 mA
ZO Open-loop output impedance VS = 5 V, f = 10 MHz 250 Ω
POWER SUPPLY
VS Specified voltage range 1.8 5.5 V
IQ Quiescent current per amplifier VS = 5 V, IO = 0 mA, TA = –40°C to 125°C 400 575 µA
TEMPERATURE
TA Specified –40 125 °C
Tstg Storage –65 150 °C
(1) Third-order filter; bandwidth = 80 kHz at –3 dB.

7.8 Typical Characteristics

Table 1. Table of Graphs

TITLE FIGURE
Offset Voltage Production Distribution Figure 1
Offset Voltage vs Common-Mode Voltage Figure 2
Open- Loop Gain and Phase vs Frequency Figure 3
Input Bias and Offset Current vs Temperature Figure 4
Input Voltage Noise Spectral Density vs Frequency Figure 5
Quiescent Current vs Supply Voltage Figure 6
Small-Signal Overshoot vs Load Capacitance Figure 7
No Phase Reversal Figure 8
Small-Signal Step Response Figure 9
Large-Signal Step Response Figure 10
Short-Circuit Current vs Temperature Figure 11
Electromagnetic Interference Rejection Ratio Referred to Noninverting Input vs Frequency Figure 12
Channel Separation vs Frequency Figure 13

7.9 Typical Characteristics

at TA = 25°C, VS = 5.5 V, RL = 10 kΩ connected to VS / 2, VCM = VS / 2, and VOUT = VS / 2 (unless otherwise noted)
TLV316 TLV2316 TLV4316 C001_OT.png
Distribution taken from 12551 amplifiers
Figure 1. Offset Voltage Production Distribution
TLV316 TLV2316 TLV4316 C006_SBOS703.png
VCM < (V+) – 1.4 V
Figure 3. Open-Loop Gain and Phase vs Frequency
TLV316 TLV2316 TLV4316 C015_SBOS703.png
Figure 5. Input Voltage Noise Spectral Density vs Frequency
TLV316 TLV2316 TLV4316 C025_SBOS703.png
V+ = 2.75 V, V– = –2.75 V, G = –1 V/V
Figure 7. Small-Signal Overshoot vs Load Capacitance
TLV316 TLV2316 TLV4316 C030_SBOS703.png
V+ = 2.75 V, V– = –2.75 V, G = 1 V/V
Figure 9. Small-Signal Step Response
TLV316 TLV2316 TLV4316 C034_OT.png
Figure 11. Short-Circuit Current vs Temperature
TLV316 TLV2316 TLV4316 C00111_SBOS703.png
V+ = 2.75 V, V– = –2.75 V
Figure 13. Channel Separation vs Frequency
TLV316 TLV2316 TLV4316 C004_OT.png
V+ = 2.75 V, V– = –2.75 V, 9 typical units shown
Figure 2. Offset Voltage vs Common-Mode Voltage
TLV316 TLV2316 TLV4316 C009_OT.png
Figure 4. Input Bias and Offset Current vs Temperature
TLV316 TLV2316 TLV4316 C020_OT.png
Figure 6. Quiescent Current vs Supply Voltage
TLV316 TLV2316 TLV4316 C027_SBOS703.png
V+ = 2.75 V, V– = –2.75 V
Figure 8. No Phase Reversal
TLV316 TLV2316 TLV4316 C031_SBOS703.png
V+ = 2.75 V, V– = –2.75 V, CL = 100 pF, G = 1 V/V
Figure 10. Large-Signal Step Response
TLV316 TLV2316 TLV4316 C036_SBOS703.png
PRF = –10 dBm
Figure 12. Electromagnetic Interference Rejection Ratio
Referred to Noninverting Input vs Frequency