JAJSD44B April   2017  – February 2021 TLV61046A

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Soft Start
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Output Short Circuit Protection
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application - 12-V Output Boost Converter
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH Tools
        2. 8.2.2.2 Programming the Output Voltage
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Input and Output Capacitor Selection
      3. 8.2.3 Application Performance Curves
    3. 8.3 System Examples
      1. 8.3.1 Fixed 12-V Output Voltage with Three External Components
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TLV61046AUNIT
DBV (SOT23)
6 PINS
RθJAJunction-to-ambient thermal resistance177.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance120.6
RθJBJunction-to-board thermal resistance33.2
ψJTJunction-to-top characterization parameter21.5
ψJBJunction-to-board characterization parameter32.6
RθJC(bot)Junction-to-case (bottom) thermal resistancen/a
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.