JAJSED6D August 2013 – July 2019 TLV702-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | TLV702-Q1 | UNIT | |||
---|---|---|---|---|---|
DDC (SOT) | DBV (SOT) | DSE (WSON) | |||
5 PINS | 5 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 262.8 | 249.2 | 321.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 68.2 | 136.4 | 207.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 81.6 | 85.9 | 281.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.1 | 19.5 | 42.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 80.9 | 85.3 | 284.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 142.3 | °C/W |