SNVSBY3A November 2020 – April 2021 TLV840-Q1
PRODUCTION DATA
THERMAL METRIC(1) | TLV840-Q1 | UNIT | |
---|---|---|---|
DBV (SOT23-5) | |||
5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 193.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 117.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 98.5 | °C/W |
ψJT | Junction-to-top characterization parameter | 43.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 97.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |