SBOS685C April   2014  – July 2015 TMP007

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Spectral Responsivity
      2. 7.3.2 Field of View and Angular Response
      3. 7.3.3 Thermopile Principles and Operation
      4. 7.3.4 Object Temperature Calculation
      5. 7.3.5 Calibration
      6. 7.3.6 Sensor Voltage Format
      7. 7.3.7 Temperature Format
      8. 7.3.8 Serial Interface
        1. 7.3.8.1  Bus Overview
        2. 7.3.8.2  Serial Bus Address
        3. 7.3.8.3  Writing and Reading Operations
        4. 7.3.8.4  Slave Mode Operations
          1. 7.3.8.4.1 Slave Receiver Mode
          2. 7.3.8.4.2 Slave Transmitter Mode:
        5. 7.3.8.5  SMBus Alert Function
        6. 7.3.8.6  General Call
        7. 7.3.8.7  High-Speed (Hs) Mode
        8. 7.3.8.8  Timeout Function
        9. 7.3.8.9  Two-Wire Timing
        10. 7.3.8.10 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Temperature Transient Correction
      2. 7.4.2 Alert Modes: Interupt (INT) and Comparator (COMP)
        1. 7.4.2.1 INT Mode (INT/COMP = 0)
        2. 7.4.2.2 COMP Mode (INT/COMP = 1)
      3. 7.4.3 Nonvolatile Memory Description
        1. 7.4.3.1 Programming the Nonvolatile Memory
        2. 7.4.3.2 Memory Store and Register Load From Memory
    5. 7.5 Register Maps
      1. 7.5.1  Sensor Voltage Result Register (address = 00h) [reset = 0000h]
      2. 7.5.2  TDIE Local Temperature Result Register (address = 01h) [reset = 0000h]
      3. 7.5.3  Configuration Register (address = 02h) [reset = 1440h]
      4. 7.5.4  TOBJ Object Temperature Result Register (address = 03h) [reset = 0000h]
      5. 7.5.5  Status Register (address = 04h) [reset = 0000h]
      6. 7.5.6  Status Mask and Enable Register (address = 05h) [reset = 0000h]
      7. 7.5.7  TOBJ Object Temperature High-Limit Register (address = 06h) [reset = 7FC0h]
      8. 7.5.8  TOBJ Object Temperature Low-Limit Register (address = 07h) [reset = 8000h]
      9. 7.5.9  TDIE Local Temperature High-Limit Register (address = 08h) [reset = 7FC0h]
      10. 7.5.10 TDIE Local Temperature Low-Limit Register (address = 09h) [reset = 8000h]
      11. 7.5.11 Coefficient Registers
        1. 7.5.11.1 S0 Coefficient Register (address = 0Ah) [reset = 260Eh]
        2. 7.5.11.2 A1 Coefficient Register (address = 0Bh) [reset = 0106h]
        3. 7.5.11.3 A2 Coefficient Register (address = 0Ch) [reset = FF9Bh]
        4. 7.5.11.4 B0 Coefficient Register (address = 0Dh) [reset = FF3Ah]
        5. 7.5.11.5 B1 Coefficient Register (address = 0Eh) [reset = FF71h]
        6. 7.5.11.6 B2 Coefficient Register (address = 0Fh) [reset = 0553h]
        7. 7.5.11.7 C2 Coefficient Register (address = 10h) [reset = 0000h]
        8. 7.5.11.8 TC0 Coefficient Register (address = 11h) [reset = 0034h]
        9. 7.5.11.9 TC1 Coefficient Register (address = 12h) [reset = 0000h]
      12. 7.5.12 Manufacturer ID Register (address = 1Eh) [reset = 5449h]
      13. 7.5.13 Device ID Register (address = 1Fh) [reset = 0078h]
      14. 7.5.14 Memory Access Register (address = 2Ah) [reset = 0000h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common Versus Unit Calibration
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Wide-Range Calibration
          2. 8.2.1.2.2 Verifying the Calibration
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Narrow-Range Calibration Example: TOBJ = 33°C to 41°C, Unit vs Common Calibration
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Narrow-Range Calibration
          2. 8.2.2.2.2 Verifying the Calibration
        3. 8.2.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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発注情報

4 Revision History

Changes from B Revision (May 2014) to C Revision

  • Changed Features, Applications, and Description sectionsGo
  • Changed thermopile sensor portion of functional block diagramGo
  • Changed Handling Ratings to ESD Ratings and moved storage temperature to Absolute Maximum RatingsGo
  • Added "full angle" to clarify field of view parameter in Electrical CharacteristicsGo
  • Changed Figure 2Go
  • Changed thermopile sensor portion of functional block diagramGo
  • Deleted last sentence from 2nd paragraph of Field of View and Angular Response sectionGo
  • Added Figure 20 Go
  • Changed text in Thermopile Principles and Operation section to clarify temperature measurement Go
  • Changed value in Stefan-Boltzman constant definition from 5.7 to 5.67 in Equation 5 Go
  • Changed C to C2 in Table 1Go
  • Changed recalibration item 3 in Calibration sectionGo
  • Changed recalibration item 8 in Calibration sectionGo
  • Added Sensor Voltage Format sectionGo
  • Added Temperature Format sectionGo
  • Changed text in Temperature Format section to clarify temperature conversion to degrees CelsiusGo
  • Changed text in Slave Receiver Mode sectionGo
  • Changed text in Slave Transmitter Mode sectionGo
  • Changed Figure 24 to clarify timingGo
  • Changed incorrect SDA timing in Figure 25Go
  • Changed SDA timing in Figure 26 Go
  • Changed register names in Table 7 to match registers in the rest of document. Go
  • Changed register 2 reset valueGo
  • Changed C coefficient to C2 coefficient in Table 7Go
  • Added Manufacturer ID registerGo
  • Added missing numbers (3, 2, and 1) to bit descriptions for A1, A2, B0, B1, and B2.Go
  • Changed register names in Table 8 to match register names in rest of documentGo
  • Changed C coefficient to C2 coefficient in Table 8Go
  • Changed Figure 31 bit register to show correct bit namesGo
  • Changed Figure 32 bit register reset valuesGo
  • Added TOBJ to all Object Temperature titles in data sheet Go
  • Changed Figure 36 to Figure 39 bit register descriptions to show correct bit namesGo
  • Changed Figure 40 bit register reset valuesGo
  • Deleted "Twos complement format" from S0 bit description Go
  • Changed Figure 41 bit register reset valuesGo
  • Changed Figure 42 bit register reset valuesGo
  • Changed C to C2 in C2 Coefficient Register sectionGo
  • Added Manufacturer ID registerGo
  • Changed Figure 50 bit register names and reset valuesGo
  • Changed bit names in Figure 51 to match the text shown in Table 8Go
  • Changed bit names in Figure 52 to match the text shown in Table 8Go
  • Changed capacitor in Figure 53 from 0.01 µF to 0.1 µFGo
  • Changed capacitor in Figure 56 from 0.01 µF to 0.1 µFGo
  • Changed σB to σ in Equation 20 to show correct Stefan-Boltzmann symbolGo
  • Changed symbol for Stefan-Boltzmann constant from B to σ in Equation 20 Go
  • Changed decoupling capacitor in Power-Supply Recommendations section from 0.01 µF to 0.1 µFGo
  • Changed title for Figure 61 Go
  • Deleted Figure 63, Bottom Layer Go

Changes from A Revision (May 2014) to B Revision

Changes from * Revision (May 2014) to A Revision

  • Changed from product preview to production data Go