SBOS371B August   2006  – October 2014 TMP401

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: V+ = 3 V to 5.5 V
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Standard and Extended Temperature Measurement Range
      2. 7.3.2 Remote Sensing
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Alert Function
      2. 7.4.2 THERM (Pin 4) and ALERT/THERM2 (Pin 6)
      3. 7.4.3 Sensor Fault
      4. 7.4.4 High-Speed Mode
      5. 7.4.5 Shutdown Mode (SD)
      6. 7.4.6 One-Shot Conversion
      7. 7.4.7 General-Call Reset
    5. 7.5 Programming
      1. 7.5.1 Bus Overview
      2. 7.5.2 Serial Interface
      3. 7.5.3 Serial Bus Address
      4. 7.5.4 Read and Write Operations
      5. 7.5.5 Timeout Function
      6. 7.5.6 Timing Diagrams
    6. 7.6 Register Maps
      1. 7.6.1  Pointer Register
      2. 7.6.2  Temperature Registers
      3. 7.6.3  Limit Registers
      4. 7.6.4  Status Register
      5. 7.6.5  Configuration Register
      6. 7.6.6  Resolution Register
      7. 7.6.7  Conversion Rate Register
      8. 7.6.8  Identification Registers
      9. 7.6.9  Consecutive Alert Register
      10. 7.6.10 THERM Hysteresis Register
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Filtering
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Series Resistance Cancellation
        2. 8.2.3.2 Differential Input Capacitance
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Measurement Accuracy and Thermal Considerations
      2. 10.1.2 Layout Considerations
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
Power supply, V+ 7.0 V
Input and output voltage(2) –0.5 (V+) + (0.5) V
Input current 10 mA
Operating temperature range –55 +125 °C
Junction Temperature (TJ max) +150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input voltage rating applies to all TMP401 input and output pins.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –60 +130 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –3000 3000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –1000 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
V+ Positive supply (3 V to 5.5 V) 5 V
TA Ambient temperature 25 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP401 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 78.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 71.6
RθJB Junction-to-board thermal resistance 68.2
ψJT Junction-to-top characterization parameter 22.0
ψJB Junction-to-board characterization parameter 67.6
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics: V+ = 3 V to 5.5 V

At TA = –40°C to +125°C, and V+ = 3 V to 5.5 V, unless otherwise noted.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE ERROR
TELOCAL Local temperature sensor TA = –40°C to +125°C ±1 ±3 °C
TEREMOTE Remote temperature sensor(1) TA = +15°C to +75°C, TREMOTE = –40°C to +150°C,
V+ = 3.3 V		 ±1 °C
TA = –40°C to +100°C, TREMOTE = –40°C to +150°C,
V+ = 3.3 V		 ±3 °C
TA = –40°C to +125°C, TREMOTE = –40°C to +150°C ±5 °C
TELOCAL and TEREMOTE versus supply V+ = 3 V to 5.5 V ±0.2 ±0.5 °C/V
TEMPERATURE MEASUREMENT
Conversion time (per channel) One-shot mode 115 ms
Resolution TELOCAL (programmable) 9 12 Bits
TEREMOTE 12 Bits
Remote sensor source currents High Series resistance, 3 kΩ max 120 µA
Medium high 60 µA
Medium low 12 µA
Low 6 µA
η Remote transistor ideality factor TMP401 optimized ideality factor 1.008
SMBus INTERFACE
VIH Logic input high voltage (SCL, SDA) 2.1 V
VIL Logic input low voltage (SCL, SDA) 0.8 V
Hysteresis 500 mV
SMBus output low sink current 6 mA
Logic input current –1 +1 µA
SMBus input capacitance (SCL, SDA) 3 pF
SMBus timeout 30 35 ms
DIGITAL OUTPUTS
VOL Output low voltage IOUT = 6 mA 0.15 0.4 V
IOH High-level output leakage current VOUT = V+ 0.1 1 µA
ALERT/THERM2 output low sink current ALERT/THERM2 forced to 0.4 V 6 mA
THERM output low sink current THERM forced to 0.4 V 6 mA
POWER SUPPLY
V+ Specified voltage range 3 5.5 V
IQ Quiescent current 0.0625 conversions per second 29 36 µA
8 conversions per second 390 450 µA
Serial bus inactive, shutdown mode 3 10 µA
Serial bus active, fS = 400 kHz, shutdown mode 90 µA
Serial bus active, fS = 2.5 MHz, shutdown mode 350 µA
UVLO Undervoltage lock out 2.3 2.4 2.6 V
POR Power-on reset threshold 1.6 2.3 V
TEMPERATURE RANGE
Specified range –40 +125 °C
Storage range –60 +130 °C
θJA Thermal resistance, VSSOP-8 150 °C/W
(1) Tested with less than 5-Ω effective series resistance and 100-pF differential input capacitance.

6.6 Timing Requirements

See the Timing Diagrams section for timing diagrams.
PARAMETER FAST MODE HIGH-SPEED MODE UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency 0.001 0.4 0.001 2.5 MHz
t(BUF) Bus free time between stop and start condition 600 160 ns
t(HDSTA) Hold time after repeated start condition.
After this period, the first clock is generated.		 600 160 ns
t(SUSTA) Repeated start condition setup time 600 160 ns
t(SUSTO) Stop condition setup time 600 160 ns
t(HDDAT) Data hold time 100 80 ns
t(SUDAT) Data setup time 100 60 ns
t(LOW) SCL clock low period 1300 260 ns
t(HIGH) SCL clock high period 600 60 ns
Clock rise and fall time 300 40 ns
tF Data fall time 300 120 ns
tR Data rise time for SCL ≤ 100 kHz 300 ns
1000 ns

6.7 Typical Characteristics

At TA = +25°C and V+ = 5.0 V, unless otherwise noted.
tc_remote_err-tmp_sbos371.gif
Figure 1. Remote Temperature Error vs Temperature
tc_remote_err-lkg_res_sbos371.gif
Figure 3. Remote Temperature Error vs Leakage Resistance
tc_remote_err-series_res2_sbos371.gif
Figure 5. Remote Temperature Error vs Series Resistance (Transistor-Connected Configuration; see Figure 11)
tc_tmp_err-noise_frq_sbos371.gif
Figure 7. Temperature Error vs
Power-Supply Noise Frequency
tc_shutdown_iq-scl_frq_sbos371.gif
Figure 9. Shutdown Quiescent Current vs
SCL Clock Frequency
tc_local_err-tmp_sbos371.gif
Figure 2. Local Temperature Error vs Temperature
tc_remote_err-series_res1_sbos371.gif
Figure 4. Remote Temperature Error vs Series Resistance (Diode-Connected Configuration; see Figure 11)
tc_remote_err-diff_cap_sbos371.gif
Figure 6. Remote Temperature Error vs
Differential Capacitance
tc_iq-conv_rate_sbos371.gif
Figure 8. Quiescent Current vs Conversion Rate
tc_shutdown_iq-vsupply_sbos371.gif
Figure 10. Shutdown Quiescent Current vs Supply Voltage