TMS570LC4357-EP Hercules™ Microcontroller Based on the ARM® Cortex®-R Core

1 Device Overview

1.1 Features

• High-Performance Automotive-Grade Microcontroller for Safety-Critical Applications
  • Dual-Core Lockstep CPUs With ECC-Protected Caches
  • ECC on Flash and RAM Interfaces
  • Built-In Self-Test (BIST) for CPU, High-End Timers, and On-Chip RAMs
  • Error Signaling Module (ESM) With Error Pin
  • Voltage and Clock Monitoring
• ARM® Cortex® - R5F 32-Bit RISC CPU
  • 1.66 DMIPS/MHz With 8-Stage Pipeline
  • FPU With Single- and Double-Precision
  • 16-Region Memory Protection Unit (MPU)
  • 32KB of Instruction and 32KB of Data Caches With ECC
  • Open Architecture With Third-Party Support
• Operating Conditions
  • Up to 300-MHz CPU Clock
  • Core Supply Voltage (VCC): 1.14 to 1.32 V
  • I/O Supply Voltage (VCCIO): 3.0 to 3.6 V
• Integrated Memory
  • 4MB of Program Flash With ECC
  • 512KB of RAM With ECC
  • 128KB of Data Flash for Emulated EEPROM With ECC
• 16-Bit External Memory Interface (EMIF)
• Hercules™ Common Platform Architecture
  • Consistent Memory Map Across Family
  • Real-Time Interrupt (RTI) Timer (OS Timer)
  • Two 128-Channel Vectored Interrupt Modules (VIMs) With ECC Protection on Vector Table
    • VIM1 and VIM2 in Safety Lockstep Mode
  • Two 2-Channel Cyclic Redundancy Checker (CRC) Modules
• Direct Memory Access (DMA) Controller
  • 32 Channels and 48 Peripheral Requests
  • ECC Protection for Control Packet RAM
  • DMA Accesses Protected by Dedicated MPU
• Frequency-Modulated Phase-Locked Loop (FMPLL) With Built-In Slip Detector
• Separate Nonmodulating PLL
• IEEE 1149.1 JTAG, Boundary Scan, and ARM CoreSight™ Components
• Advanced JTAG Security Module (AJSM) 
• Trace and Calibration Capabilities
  • ETM™, RTP, DMM, POM
• Multiple Communication Interfaces
  • 10/100 Mbps Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant (3.3-V I/O Only)
    • Supports MII, RMII, and MDIO
  • FlexRay Controller With 2 Channels
    • 8KB of Message RAM With ECC Protection
    • Dedicated FlexRay Transfer Unit (FTU)
  • Four CAN Controller (DCAN) Modules
    • 64 Mailboxes, Each With ECC Protection
    • Compliant to CAN Protocol Version 2.0B
  • Two Inter-Integrated Circuit (I²C) Modules
  • Five Multibuffered Serial Peripheral Interface (MibSPI) Modules
    • MibSPI1: 256 Words With ECC Protection
    • Other MibSPIs: 128 Words With ECC Protection
  • Four UART (SCI) Interfaces, Two With Local Interconnect Network (LIN 2.1) Interface Support
• Two Next Generation High-End Timer (N2HET) Modules
  • 32 Programmable Channels Each
  • 256-Word Instruction RAM With Parity
  • Hardware Angle Generator for Each N2HET
  • Dedicated High-End Timer Transfer Unit (HTU) for Each N2HET
• Two 12-Bit Multibuffered Analog-to-Digital Converter (MibADC) Modules
  • MibADC1: 32 Channels Plus Control for up to 1024 Off-Chip Channels
  • MibADC2: 25 Channels
  • 16 Shared Channels
  • 64 Result Buffers Each With Parity Protection
• Enhanced Timing Peripherals
  • 7 Enhanced Pulse Width Modulator (ePWM) Modules
  • 6 Enhanced Capture (eCAP) Modules
  • 2 Enhanced Quadrature Encoder Pulse (eQEP) Modules
• Three On-Die Temperature Sensors
• Up to 145 Pins Available for General-Purpose I/O (GPIO)
• 16 Dedicated GPIO Pins With External Interrupt Capability
• Packages
  • 337-Ball Grid Array (GWT) [Green]
• Supports Defense, Aerospace, and Medical Applications:
  • Controlled Baseline
  • One Assembly/Test Site
  • One Fabrication Site
  • Available in Extended (–55°C to 125°C) Temperature Range
  • Extended Product Life Cycle
  • Extended Product-Change Notification
  • Product Traceability

1.2 Applications

• Braking Systems (Antilock Brake Systems and Electronic Stability Control)
• Electric Power Steering (EPS)
• HEV and EV Inverter Systems
• Battery-Management Systems
• Active Driver Assistance Systems
• Aerospace and Avionics
• Railway Communications
• Off-road Vehicles