JAJSO44A June   2023  – July 2024 TMUX582F-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Global)
    6. 5.6 Dual Supply: Electrical Characteristics
    7. 5.7 Single Supply: Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  Off-Leakage Current
    3. 6.3  On-Leakage Current
    4. 6.4  Input and Output Leakage Current Under Overvoltage Fault
    5. 6.5  Break-Before-Make Delay
    6. 6.6  Enable Delay Time
    7. 6.7  Transition Time
    8. 6.8  Fault Response Time
    9. 6.9  Fault Recovery Time
    10. 6.10 Fault Flag Response Time
    11. 6.11 Fault Flag Recovery Time
    12. 6.12 Charge Injection
    13. 6.13 Off Isolation
    14. 6.14 Crosstalk
    15. 6.15 Bandwidth
    16. 6.16 THD + Noise
  8. 7 Truth Table
  9. 8 Detailed Description
    1. 8.1 Functional Block Diagram
    2. 8.2 Feature Description
      1. 8.2.1 Flat ON- Resistance
      2. 8.2.2 Protection Features
        1. 8.2.2.1 Input Voltage Tolerance
        2. 8.2.2.2 Powered-Off Protection
        3. 8.2.2.3 Fail-Safe Logic
        4. 8.2.2.4 Overvoltage Protection and Detection
        5. 8.2.2.5 Adjacent Channel Operation During Fault
        6. 8.2.2.6 ESD Protection
        7. 8.2.2.7 Latch-Up Immunity
        8. 8.2.2.8 EMC Protection
      3. 8.2.3 Overvoltage Fault Flags
      4. 8.2.4 Bidirectional and Rail-to-Rail Operation
      5. 8.2.5 1.8V Logic Compatible Inputs
      6. 8.2.6 Integrated Pull-Down Resistor on Logic Pins
    3. 8.3 Device Functional Modes
      1. 8.3.1 Normal Mode
      2. 8.3.2 Fault Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 System Diagnostics – Telemetry
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • PW|20
サーマルパッド・メカニカル・データ
発注情報

9.4.1 Layout Guidelines

The following figure illustrates an example of a PCB layout with the TMUX582F-SEP. Some key considerations are as follows:

  • Decouple the VDD and VSS pins with a 0.1µF capacitor, placed as close to the pin as possible. Ensure that the capacitor voltage rating is sufficient for the VDD and VSS supplies.
  • Keep the input lines as short as possible.
  • Use a solid ground plane to help distribute heat and reduce electromagnetic interference (EMI) noise pickup.
  • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible, and only make perpendicular crossings when necessary.