SLOS649B March   2010  – May 2016 TPA2026D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Timing Requirements
    7. 7.7 Dissipation Ratings
    8. 7.8 Operating Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Automatic Gain Control
        1. 9.3.1.1 Fixed Gain
        2. 9.3.1.2 Limiter Level
        3. 9.3.1.3 Compression Ratio
        4. 9.3.1.4 Interaction Between Compression Ratio and Limiter Range
        5. 9.3.1.5 Noise Gate Threshold
        6. 9.3.1.6 Maximum Gain
        7. 9.3.1.7 Attack, Release, and Hold Time
      2. 9.3.2 Operation With DACS and CODECS
      3. 9.3.3 Short-Circuit Auto-Recovery
      4. 9.3.4 Filter-Free Operation and Ferrite Bead Filters
    4. 9.4 Device Functional Modes
      1. 9.4.1 TPA2026D2 AGC Operation
        1. 9.4.1.1 AGC Start-Up Condition
      2. 9.4.2 TPA2026D2 AGC Recommended Settings
    5. 9.5 Programming
      1. 9.5.1 General I2C Operation
      2. 9.5.2 Single and Multiple-Byte Transfers
      3. 9.5.3 Single-Byte Write
      4. 9.5.4 Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 9.5.5 Single-Byte Read
      6. 9.5.6 Multiple-Byte Read
    6. 9.6 Register Maps
      1. 9.6.1 IC Function Control (Address: 1)
      2. 9.6.2 AGC Attack Control (Address: 2)
      3. 9.6.3 AGC Release Control (Address: 3)
      4. 9.6.4 AGC Hold Time Control (Address: 4)
      5. 9.6.5 AGC Fixed Gain Control (Address: 5)
      6. 9.6.6 AGC Control (Address: 6)
      7. 9.6.7 AGC Control (Address: 7)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2026D2 With Differential Input Signals
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Surface Mount Capacitor
          2. 10.2.1.2.2 Decoupling Capacitor, CS
          3. 10.2.1.2.3 Input Capacitors, CI
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2026D2 With Single-Ended Input Signal
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Pad Size
      2. 12.1.2 Component Location
      3. 12.1.3 Trace Width
    2. 12.2 Layout Example
    3. 12.3 Efficiency and Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 YZH Package Dimensions

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

Nano-Free, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.