SLOS733B January   2012  – April 2016 TPA2080D1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Differential Amplifier
        1. 9.3.1.1 Advantages of Fully Differential Amplifiers
      2. 9.3.2 Short-Circuit Auto-Recovery
      3. 9.3.3 Operation With DACs and CODECs
      4. 9.3.4 Speaker Load Limitation
      5. 9.3.5 Filter-Free Operation and Ferrite Bead Filters.
      6. 9.3.6 Boost Converter Auto Pass Through (APT)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPA2080D1 With Differential Input Signal
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Surface Mount Inductor
          2. 10.2.1.2.2 Inductor Selection
          3. 10.2.1.2.3 Surface Mount Capacitors
          4. 10.2.1.2.4 Boost Converter Capacitor Selection
          5. 10.2.1.2.5 Decoupling Capacitors
          6. 10.2.1.2.6 Input Capacitors
          7. 10.2.1.2.7 Boost Converter Component Section
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2080D1 With Single-Ended Signals.
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Placement
      2. 12.1.2 Thermal Considerations
      3. 12.1.3 Pad Size
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Device Nomenclature
        1. 13.1.2.1 Boost Terms
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Dimensions

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Layout

12.1 Layout Guidelines

12.1.1 Component Placement

Place all the external components close to the TPA2080D1 device. Placing the decoupling capacitors as close as possible to the device is important for the efficiency of the class-D amplifier. Any resistance or inductance in the trace between the device and the capacitor can cause a loss in efficiency.

12.1.2 Thermal Considerations

It is important to operate the TPA2080D1 at temperatures lower than its maximum operating temperature. The maximum ambient temperature depends on the heat-sinking ability of the PCB system. Given θJA of 97.3°C/W, the maximum allowable junction temperature of 150°C, and the internal dissipation of 0.5 W for 1.9-W, 8 Ω-load, 3.6-V supply, the maximum ambient temperature is calculated as:

Equation 5. TA,MAX = TJ,MAX – θJAPD = 150°C – (97.3°C/W × 0.5 W) = 101.4°C

The calculated maximum ambient temperature is 101.4°C at maximum power dissipation at 3.6-V supply and 8-Ω load. The TPA2080D1 is designed with thermal protection that turns the device off when the junction temperature surpasses 150°C to prevent damage to the IC.

12.1.3 Pad Size

TPA2080D1 has AGND, BGND and PGND for analog circuit, boost converter and Class-D amplifier respectively. These three ground pins should be connected together through a solid ground plane with multiple ground VIAs.

In making the pad size for the WCSP balls, it is recommended that the layout use non-solder mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 25 shows the appropriate diameters for a WCSP layout.

TPA2080D1 land_pattern_los717.gif Figure 25. Land Pattern Dimensions

Table 7. Land Pattern Dimensions(1) (3) (2) (4)

SOLDER PAD
DEFINITIONS		 COPPER
PAD		 SOLDER MASK (5)
OPENING		 COPPER
THICKNESS		 STENCIL (6) (7)
OPENING		 STENCIL
THICKNESS
Nonsolder mask defined (NSMD) 275 μm
(+0.0, -25 μm)		 375 μm (+0.0, -25 μm) 1 oz max (32 μm) 275 μm x 275 μm Sq.
(rounded corners)		 125 μm thick
(1) Circuit traces from NSMD defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening. Wider trace widths reduce device stand off and impact reliability.
(2) Recommend solder paste is Type 3 or Type 4.
(3) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the intended application.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern
(6) Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in inferior solder paste volume control.
(7) Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to solder wetting forces.

12.2 Layout Example

TPA2080D1 layout_SLOS733.gif Figure 26. Layout Recommendation