JAJSC84F May   2016  – January 2020 TPA3136AD2 , TPA3136D2

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Switching Characteristics
    7. 8.7 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Fixed Analog Gain
      2. 10.3.2 SD Operation
      3. 10.3.3 PLIMIT
      4. 10.3.4 Spread Spectrum and De-Phase Control
      5. 10.3.5 GVDD Supply
      6. 10.3.6 DC Detect
      7. 10.3.7 PBTL Select
      8. 10.3.8 Short-Circuit Protection and Automatic Recovery Feature
      9. 10.3.9 Thermal Protection
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 PCB Material Recommendation
        2. 11.2.1.2 PVCC Capacitor Recommendation
        3. 11.2.1.3 Decoupling Capacitor Recommendations
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Ferrite Bead Filter Considerations
        2. 11.2.2.2 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
        3. 11.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 11.2.2.4 Input Resistance
        5. 11.2.2.5 Input Capacitor, Ci
        6. 11.2.2.6 BSN and BSP Capacitors
        7. 11.2.2.7 Differential Inputs
        8. 11.2.2.8 Using Low-ESR Capacitors
      3. 11.2.3 Application Performance Curves
        1. 11.2.3.1 EN55013 Radiated Emissions Results
        2. 11.2.3.2 EN55022 Conducted Emissions Results
  12. 12Power Supply Recommendations
    1. 12.1 Power Supply Decoupling, CS
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 デバイス・サポート
      1. 14.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 14.2 ドキュメントのサポート
      1. 14.2.1 関連資料
    3. 14.3 関連リンク
    4. 14.4 ドキュメントの更新通知を受け取る方法
    5. 14.5 サポート・リソース
    6. 14.6 商標
    7. 14.7 静電気放電に関する注意事項
    8. 14.8 Glossary
  15. 15メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3.9 Thermal Protection

Thermal protection on the TPA3136D2, TPA3136AD2 device prevents damage to the device when the internal die temperature exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a latched fault.

Thermal protection faults are reported on the FAULT pin.

If automatic recovery from the thermal protection latch is desired, connect the FAULT pin directly to the SD pin. This allows the FAULT pin function to automatically drive the SD pin low which clears the thermal protection latch.