SLOS992 December   2017 TPA3156D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 AC Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Gain Setting and Master and Slave
      2. 7.3.2  Input Impedance
      3. 7.3.3  Startup and Shutdown Operation
      4. 7.3.4  PLIMIT Operation
      5. 7.3.5  GVDD Supply
      6. 7.3.6  BSPx AND BSNx Capacitors
      7. 7.3.7  Differential Inputs
      8. 7.3.8  Device Protection System
      9. 7.3.9  DC Detect Protection
      10. 7.3.10 Short-Circuit Protection and Automatic Recovery Feature
      11. 7.3.11 Thermal Protection
      12. 7.3.12 Device Modulation Scheme
        1. 7.3.12.1 BD-Modulation
      13. 7.3.13 Efficiency: LC Filter Required with the Traditional Class-D Modulation Scheme
      14. 7.3.14 Ferrite Bead Filter Considerations
      15. 7.3.15 When to Use an Output Filter for EMI Suppression
      16. 7.3.16 AM Avoidance EMI Reduction
    4. 7.4 Device Functional Modes
      1. 7.4.1 PBTL Mode
      2. 7.4.2 Mono Mode (Single Channel Mode)
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requriements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the PWM Frequency
        2. 8.2.2.2 Select the Amplifier Gain and Master/Slave Mode
        3. 8.2.2.3 Select Input Capacitance
        4. 8.2.2.4 Select Decoupling Capacitors
        5. 8.2.2.5 Select Bootstrap Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Mode
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Heat Sink Used on the EVM
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

1 Features

  • 2 × 70 W Into a 4-Ω BTL Load at 24 V
  • Wide Voltage Range: 4.5 V to 26 V
  • Efficient Class-D Operation
    • Very Low Idle Current: <23 mA for recommended LC filter configurations
    • Greater than 90% Power Efficiency
    • Adaptive Modulation Schemes based on Output Power
  • Multiple Switching Frequencies
    • AM Avoidance
    • Master and Slave Synchronization
    • 300-KHz to 1.2-MHz Switching Frequency
  • Feedback Power-Stage Architecture With High PSRR Reduces PSU Requirements
  • Programmable Power Limit
  • Parallel BTL Mode and Mono-Channel Mode Support
  • Supports Both Single and Dual Power Supply Modes
  • Integrated Self-Protection Circuits Including Overvoltage, Undervoltage, Overtemperature, DC-Detect, and Short Circuit With Error Reporting
  • Thermally Enhanced Packages
    • DAD (32-Pin HTSSOP Pad Up)
  • Pin to Pin Compatible with TPA3116D2 and TPA3126D2

2 Applications

  • Bluetooth/Wireless Speakers
  • Soundbars
  • Mini-Micro Component, Docks
  • Home Theaters

3 Description

The TPA3156D2 has low idle power loss and helps to extend the battery life of Bluetooth/Wireless speakers and other battery-powered audio systems. The high efficiency of the TPA3156D2 device allows it to do 2 × 70 W with external heat sink on a dual layer PCB. This device integrates an efficiency boost mode, which dynamically reduces the current ripple of the external LC filter and the idle current .

The TPA3156D2 advanced oscillator/PLL circuit employs a multiple switching frequency option to avoid AM interferences, which is achieved together with an option of either master or slave option, making it possible to synchronize multiple devices.

The TPA3156D2 devices are fully protected against faults with short-circuit protection and thermal protection as well as overvoltage, undervoltage, and DC protection. Faults are reported back to the processor to prevent devices from being damaged during overload conditions.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPA3156D2 DAD (32) 11.00 mm × 6.20 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Application Circuit

TPA3156D2 TPA3156-Diagram-For-First-Page.gif