Use an unbroken ground plane to have good low impedance and inductance return path to the power supply for power and audio signals.
Maintain a contiguous ground plane from the ground pins to the PCB area surrounding the device for as many of the ground pins as possible, since the ground pins are the best conductors of heat in the package.
PCB layout, audio performance and EMI are linked closely together.
Routing the audio input should be kept short and together with the accompanied audio source ground.
The small bypass capacitors on the PVDD lines
should be placed as close to the PVDD pins as possible.
A solid local ground area underneath the device
is important to minimize ground bounce.
Orient the passive component so that the narrow end of the passive component is facing the TPA3223 device, unless the area between two pads of a passive component is large enough to allow copper to flow in between the two pads.
Avoid placing other heat producing components or structures near the TPA3223 device.
Avoid cutting off the flow of heat from the TPA3223 device to the surrounding ground areas with traces or via strings, especially on output side of device.