JAJSO54 November   2022 TPA3223

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1. 6.1 Pin Functions
  7. 7 Specifications
    1. 7.1 絶対最大定格
    2. 7.2 ESD 定格
    3. 7.3 推奨動作条件
    4. 7.4 熱に関する情報
    5. 7.5 電気的特性
    6. 7.6 オーディオ特性 (BTL)
    7. 7.7 オーディオ特性 (PBTL)
    8. 7.8 Typical Characteristics, BTL Configuration, AD-mode
    9. 7.9 Typical Characteristics, PBTL Configuration, AD-mode
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Input Configuration, Gain Setting And Primary / Peripheral Operation
      2. 9.3.2 Gain Setting And Clock Synchronization
      3. 9.3.3 PWM Modulation
      4. 9.3.4 Oscillator
      5. 9.3.5 Input Impedance
      6. 9.3.6 Error Reporting
    4. 9.4 Device Functional Modes
      1. 9.4.1 Powering Up
        1. 9.4.1.1 Startup Ramp Time
      2. 9.4.2 Powering Down
        1. 9.4.2.1 Power Down Ramp Time
      3. 9.4.3 Device Reset
      4. 9.4.4 Device Soft Mute
      5. 9.4.5 Device Protection System
        1. 9.4.5.1 Overload and Short Circuit Current Protection
        2. 9.4.5.2 Signal Clipping and Pulse Injector
        3. 9.4.5.3 DC Speaker Protection
        4. 9.4.5.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 9.4.5.5 Overtemperature Protection OTW and OTE
        6. 9.4.5.6 Undervoltage Protection (UVP), Overvoltage Protection (OVP), and Power-on Reset (POR)
        7. 9.4.5.7 Fault Handling
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo BTL Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedures
          1. 10.2.1.2.1 Decoupling Capacitor Recommendations
          2. 10.2.1.2.2 PVDD Capacitor Recommendation
          3. 10.2.1.2.3 BST capacitors
          4. 10.2.1.2.4 PCB Material Recommendation
      2. 10.2.2 Application Curves
      3. 10.2.3 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled after LC filter)
        1. 10.2.3.1 Design Requirements
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Power Supplies
        1. 10.3.1.1 VDD Supply
        2. 10.3.1.2 AVDD and GVDD Supplies
        3. 10.3.1.3 PVDD Supply
        4. 10.3.1.4 BST Supply
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Examples
        1. 10.4.2.1 BTL Application Printed Circuit Board Layout Example
        2. 10.4.2.2 PBTL (Outputs Paralleled after LC filter) Application Printed Circuit Board Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報
10.2.1.2.4 PCB Material Recommendation

FR-4 Glass Epoxy material with 2 oz. (70 μm) copper is recommended for use with the TPA3223. The use of this material can provide for higher power output, improved thermal performance, and better EMI margin due to lower PCB trace inductance.