SLRS066D January   2014  – March 2016 TPL7407L

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
    8. 6.8 Thermal Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inductive Load Drive
      2. 7.4.2 Resistive Load Drive
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Inductive Load Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 TTL and other Logic Inputs
          2. 8.2.1.2.2 Input RC Snubber
          3. 8.2.1.2.3 High-impedance Input Drivers
          4. 8.2.1.2.4 Drive Current
          5. 8.2.1.2.5 Output Low Voltage
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Unipolar Stepper Motschematic to correct Zener diode connection or Driver
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Multi-Purpose Sink Driver
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Improving Package Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

at 25°C free-air temperature (unless otherwise noted) (1)
MIN MAX UNIT
VOUT Pins OUT1-OUT7 to GND voltage –0.3 42 V
VOK Output Clamp diode reverse voltage(2) –0.3 42 V
VCOM COM pin voltage(2) –0.3 42 V
VIN Pins IN1-IN7 to GND voltage (2) –0.3 30 V
IDS Continuous drain current per channel(3) (4) 600 mA
IOK Output clamp current 500 mA
IGND Total continuous GND-pin current –2 A
TA Operating free-air temperature range –40 125 °C
TJ Operating virtual junction temperature –40 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the GND/substrate pin, unless otherwise noted.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

Over operating temperature range
MIN MAX UNIT
VOUT OUT1 – OUT7 pin voltage for recommended operation 0 40 V
VCOM COM pin voltage range for full output drive 8.5 40 V
VIL IN1- IN7 input low voltage ("Off" high impedance output) 0.9 V
VIH IN1- IN7 input high voltage ("Full Drive" low impedance output) 1.5 V
TJ Operating virtual junction temperature –40 125 °C
IDS Continuous drain current 0 500 mA

6.4 Thermal Information

THERMAL METRIC(1) TPL7407L UNIT
SOIC (D) TSSOP (PW)
16 PINS 16 PINS
θJA Junction-to-ambient thermal resistance 91.9 115.2 °C/W
θJCtop Junction-to-case (top) thermal resistance 50.1 49.5 °C/W
θJB Junction-to-board thermal resistance 49.4 60.8 °C/W
ψJT Junction-to-top characterization parameter 18.6 8.5 °C/W
ψJB Junction-to-board characterization parameter 49.1 60.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).

6.5 Electrical Characteristics

TJ= –40°C to 125°C; Typical Values at TA=TJ= 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOL (VDS) OUT1- OUT7 low-level output voltage VIN ≥ 1.5 V ID = 100 mA 200 320 mV
ID = 200 mA 420 650
IOUT(OFF) (IDS_OFF) OUT1- OUT7 OFF-state leakage current VOUT = 24 V, VIN ≤ 1.0 V 10 500 nA
VF Clamp forward voltage IF = 200 mA 1.4 V
IIN(off) IN1- IN7 Off-state input current VINX= 0 V VOUT = 40 V 500 nA
IIN(ON) IN1- IN7 ON state input current VINX=1.5 V - 5.0 V 10 μA
ICOM Static current flowing through COM pin VCOM = 8.5 V - 40 V 15 25 μA

6.6 Switching Characteristics

Typical Values at TA=TJ= 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH Propagation delay time, low- to high-level output VINX ≥ 1.65 V, Vpull-up = 24 V, Rpull-up = 48 Ω 350 ns
tPHL Propagation delay time, high- to low-level output VINX ≥ 1.65 V, Vpul-lup = 24 V, Rpull-up = 48 Ω 350 ns
Ci Input capacitance VI = 0, f = 100 kHz 5 pF

6.7 Typical Characteristics

TPL7407L D001_SLRS066.gif
Figure 1. VOL (VDS)
TPL7407L D002_SLRS066.gif
Figure 2. Flyback Diode Forward Voltage

6.8 Thermal Characteristics

TPL7407L D003_SLRS066.gif
Figure 3. Maximum Output Current vs. Temperature (SOIC)
TPL7407L D005_SLRS066.gif
Figure 5. D Package Maximum Collector Current vs. Duty Cycle at 25°C
TPL7407L D007_SLRS066.gif
Figure 7. PW Package Maximum Collector Current vs. Duty Cycle at 25°C
TPL7407L D004_SLRS066.gif
Figure 4. Maximum Output Current vs. Temperature (TSSOP)
TPL7407L D006_SLRS066.gif
Figure 6. D Package Maximum Collector Current vs. Duty Cycle at 70°C
TPL7407L D008_SLRS066.gif
Figure 8. PW Package Maximum Collector Current vs. Duty Cycle at 70°C