SLVSAU6H June   2011  – April 2016 TPS2000C , TPS2001C , TPS2041C , TPS2051C , TPS2061C , TPS2065C , TPS2065C-2 , TPS2068C , TPS2069C , TPS2069C-2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information: SOT-23
    5. 7.5 Thermal Information: MSOP-PowerPAD
    6. 7.6 Electrical Characteristics: TJ = TA = 25°C
    7. 7.7 Electrical Characteristics: -40°C ≤ TJ ≤ 125°C
    8. 7.8 Timing Requirements: TJ = TA = 25°C
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout
      2. 8.3.2 Enable
      3. 8.3.3 Internal Charge Pump
      4. 8.3.4 Current Limit
      5. 8.3.5 FLT
      6. 8.3.6 Output Discharge
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitance
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation and Junction Temperature
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

6 Pin Configuration and Functions

DGN Package
8-Pin MSOP-PowerPAD
Top View
DGK Package
8-Pin VSSOP
Top View

Pin Functions - 8 Pins

PIN I/O DESCRIPTION
NAME NO.
EN/EN 4 I Enable input, logic high turns on power switch
FLT 5 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions
GND 1 — Ground connection
IN 2, 3 PWR Input voltage and power-switch drain; connect a 0.1-µF or greater ceramic capacitor from IN to GND close to the IC
OUT 6, 7, 8 PWR Power-switch output, connect to load
PowerPAD (DGN Only) PowerPAD — Internally connected to GND. Connect PAD to GND plane as a heatsink for the best thermal performance. PAD may be left floating if desired. See Power Dissipation and Junction Temperature for guidance.
DBV Package
5-Pin SOT-23
Top View

Pin Functions - 5 Pins

PIN I/O DESCRIPTION
NAME NO.
EN/EN 4 I Enable input, logic high turns on power switch
FLT 3 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions
GND 2 — Ground connection
IN 5 PWR Input voltage and power-switch drain; connect a 0.1-µF or greater ceramic capacitor from IN to GND close to the IC
OUT 1 PWR Power-switch output, connect to load.