SBVS124A November   2008  – May 2016 TPS2115A-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Test Circuits
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 N-Channel MOSFETs
      2. 8.3.2 Cross-Conduction Blocking
      3. 8.3.3 Reverse-Conduction Blocking
      4. 8.3.4 Charge Pump
      5. 8.3.5 Current Limiting
      6. 8.3.6 Output Voltage Slew-Rate Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto-Switching Mode
      2. 8.4.2 Manual Switching Mode
  9. Application and Information
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

10 Power Supply Recommendations

Use well-regulated supplies on IN1 and IN2 that have sufficient capacitance for the application load transients. As close as possible to the device, use a 0.1-μF ceramic bypass capacitor between IN1 and GND for the first power supply input and a 0.1-μF ceramic bypass capacitor between IN2 and GND for the second power supply input. The recommendation is to place a high-value capacitor between OUT and GND when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input or voltage drops during load transients or supply input transitions. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor may reduce high-frequency emissions.