Input and Output traces must be as short and wide as possible to accommodate for high current.
Use vias under the exposed thermal pad for thermal relief for high current operation.
The CT Capacitor must be placed as close as
possible to the device to minimize parasitic trace capacitance. TI recommends to
cutout copper on other layers directly below CT to minimize parasitic
capacitance.
The IN terminal must be bypassed to ground with low ESR ceramic bypass capacitors. The typical recommended bypass capacitance is ceramic with X5R or X7R dielectric. This capacitor must be placed as close to the device pins as possible.
The OUT terminal must be bypassed to ground with low ESR ceramic bypass capacitors. The typical recommended bypass capacitance is ceramic with X5R or X7R dielectric. This capacitor must be placed as close to the device pins as possible.
The BIAS terminal must be bypassed to ground with low ESR ceramic bypass capacitors. The typical recommended bypass capacitance is ceramic with X5R or X7R dielectric.