JAJSIO1B December 2013 – March 2020 TPS22966-Q1
PRODUCTION DATA.
For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance.
The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. To calculate the maximum allowable power dissipation, PD(max) for a given output current and ambient temperature, use the following equation:
where
Figure 37 shows an example of a layout. Notice the thermal vias located under the exposed thermal pad of the device. This allows for thermal diffusion away from the device.