SLVSCG3F January   2014  – July 2017 TPS22968

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics (VBIAS = 5 V)
    6. 7.6 Electrical Characteristics (VBIAS = 2.5 V)
    7. 7.7 Switching Characteristics
    8. 7.8 Typical DC Characteristics
    9. 7.9 Typical AC Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON and OFF Control
      2. 9.3.2 Input Capacitor (Optional)
      3. 9.3.3 Output Capacitor (Optional)
      4. 9.3.4 QOD (Optional)
      5. 9.3.5 VIN and VBIAS Voltage Range
      6. 9.3.6 Adjustable Rise Time
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Parallel Configuration
      2. 10.1.2 Standby Power Reduction
      3. 10.1.3 Power Supply Sequencing Without a GPIO Input
      4. 10.1.4 Reverse Current Blocking
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 VIN to VOUT Voltage Drop
        2. 10.2.2.2 Inrush Current
        3. 10.2.2.3 Thermal Considerations
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3 Recommended Operating Conditions

MIN MAX UNIT
VIN1,2 Input voltage 0.8 VBIAS V
VBIAS Bias voltage 2.5 5.5 V
VON1,2 ON voltage 0 5.5 V
VOUT1,2 Output voltage VIN V
VIH, ON1,2 High-level input voltage, ON1,2 VBIAS = 2.5 V to 5.5 V 1.2 5.5 V
VIL, ON1,2 Low-level input voltage, ON1,2 VBIAS = 2.5 V to 5.5 V 0 0.5 V
CIN1,2 Input capacitor 1(1) µF
TA Operating free-air temperature (2) –40 105 °C
(1) See the Application Information section.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA(max) = TJ(max) – (RθJA × PD(max)).