JAJSQ27A March   2024  – October 2024 TPS22996H-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical DC Characteristics
    8. 5.8 Typical AC Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ON and OFF Control
      2. 7.3.2 Input Capacitor (Optional)
      3. 7.3.3 Output Capacitor (Optional)
      4. 7.3.4 Quick Output Discharge
      5. 7.3.5 Humidity Resistance
      6. 7.3.6 Thermal Shutdown
      7. 7.3.7 Adjustable Rise Time
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Power Dissipation
  10. Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

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メカニカル・データ(パッケージ|ピン)
  • DYC|8
サーマルパッド・メカニカル・データ

Power Dissipation

The maximum IC junction temperature must be restricted to 150°C under normal operating conditions. To calculate the maximum allowable power dissipation, PD(max) for a given output current and ambient temperature, use Equation 3.

Equation 3. TPS22996H-Q1

where

  • PD(max) is the maximum allowable power dissipation.
  • TJ(max) is the maximum allowable junction temperature (150°C for the TPS22996H).
  • TA is the ambient temperature of the device.
  • θJA is the junction to air thermal impedance. See Section 5.4. This parameter is highly dependent upon board layout.