SPAS093C December   2009  – September 2015 TPS2505

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (Shared Boost, LDO and USB)
    6. 6.6  Electrical Characteristics (Boost Only)
    7. 6.7  Electrical Characteristics (USB1/2 Only)
    8. 6.8  Electrical Characteristics (LDO and Reset Only)
    9. 6.9  Recommended External Components
    10. 6.10 Dissipation Ratings
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  PGND
      2. 8.3.2  IN
      3. 8.3.3  EN
      4. 8.3.4  GND
      5. 8.3.5  ILIM1/2
      6. 8.3.6  RESET
      7. 8.3.7  LDOOUT
      8. 8.3.8  LDOIN
      9. 8.3.9  ENLDO
      10. 8.3.10 FAULT1/2
      11. 8.3.11 ENUSB1/2
      12. 8.3.12 USB1/2
      13. 8.3.13 AUX
      14. 8.3.14 SW
      15. 8.3.15 Thermal Pad
      16. 8.3.16 Boost Converter
        1. 8.3.16.1 Start-Up
        2. 8.3.16.2 Normal Operation
        3. 8.3.16.3 Low-Frequency Mode
        4. 8.3.16.4 No-Frequency Mode
        5. 8.3.16.5 Pulsed Frequency Mode (PFM) Light-Load Operation
        6. 8.3.16.6 Overvoltage Protection
        7. 8.3.16.7 Overload Conditions
        8. 8.3.16.8 Determining the Maximum Allowable AUX and USB1/2 Current
      17. 8.3.17 USB Switches
        1. 8.3.17.1 Overview
        2. 8.3.17.2 Overcurrent Conditions
        3. 8.3.17.3 FAULT1/2 Response
        4. 8.3.17.4 Undervoltage Lockout
        5. 8.3.17.5 Programming the Current-Limit Threshold Resistor RILIM
      18. 8.3.18 3.3-V LDO
      19. 8.3.19 Reset Comparator
      20. 8.3.20 Thermal Shutdown
      21. 8.3.21 Component Recommendations
        1. 8.3.21.1 Boost Inductor
        2. 8.3.21.2 IN Capacitance
        3. 8.3.21.3 AUX Capacitance
        4. 8.3.21.4 USB Capacitance
        5. 8.3.21.5 ILIM1/2 and FAULT1/2 Resistors
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step-by-Step Design Procedure
        2. 9.2.2.2 Switching Frequency
        3. 9.2.2.3 AUX Voltage
        4. 9.2.2.4 Determine Maximum Total Current (IAUX + ILDO + IUSB1 + IUSB2 )
        5. 9.2.2.5 Power Inductor
        6. 9.2.2.6 Output AUX Capacitor Selection
        7. 9.2.2.7 Output USB1/2 Capacitor Selection
        8. 9.2.2.8 Input Capacitor Selection
          1. 9.2.2.8.1 Current-Limit Threshold Resistor RILIM
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

12 Device and Documentation Support

12.1 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.2 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.