JAJSBO7A February   2012  – October 2016 TPS2543

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Electrical Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics, High-Bandwidth Switch
    7. 6.7 Electrical Characteristics, Charging Controller
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Standard Downstream Port (SDP) USB 2.0/USB 3.0
      2. 8.3.2  Charging Downstream Port (CDP)
      3. 8.3.3  Dedicated Charging Port (DCP)
        1. 8.3.3.1 DCP BC1.2 and YD/T 1591-2009
        2. 8.3.3.2 DCP Divider Charging Scheme
      4. 8.3.4  Wake on USB Feature (Mouse/Keyboard Wake Feature)
        1. 8.3.4.1 USB 2.0 Background Information
        2. 8.3.4.2 Wake On USB
        3. 8.3.4.3 USB Slow-Speed Device Recognition and Operation
      5. 8.3.5  Load Detect
      6. 8.3.6  Power Wake
        1. 8.3.6.1 Implementing Power Wake in Notebook System
      7. 8.3.7  Port Power Management (PPM)
        1. 8.3.7.1 Benefits of PPM
        2. 8.3.7.2 PPM Details
        3. 8.3.7.3 Implementing PPM in a System with Two Charging Ports
      8. 8.3.8  Over-Current Protection
      9. 8.3.9  FAULT Response
      10. 8.3.10 Undervoltage Lockout (UVLO)
      11. 8.3.11 Thermal Sense
    4. 8.4 Device Functional Modes
      1. 8.4.1 DCP Auto Mode
      2. 8.4.2 DCP Forced Shorted / DCP Forced Divider1
      3. 8.4.3 High-Bandwidth Data Line Switch
      4. 8.4.4 Device Truth Table (TT)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Discharge
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current-Limit Settings
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

RTE Package
16 Pin (WQFN)
Top View

Pin Functions

NO. NAME TYPE(1) DESCRIPTION
1 IN P Input voltage and supply voltage; connect 0.1 μF or greater ceramic capacitor from IN to GND as close to the device as possible
2 DM_OUT I/O D– data line to USB host controller
3 DP_OUT I/O D+ data line to USB host controller
4 ILIM_SEL I Logic-level input signal used to control the charging mode, current limit threshold, and load detection; see the control truth table. Can be tied directly to IN or GND without pull-up or pull-down resistor.
5 EN I Logic-level input for turning the power switch and the signal switches on/off; logic low turns off the signal and power switches and holds OUT in discharge. Can be tied directly to IN or GND without pull-up or pull-down resistor.
6 CTL1 I Logic-level inputs used to control the charging mode and the signal switches; see the control truth table. Can be tied directly to IN or GND without pull-up or pull-down resistor.
7 CTL2 I
8 CTL3 I
9 STATUS O Active-low open-drain output, asserted in load detection conditions
10 DP_IN I/O D+ data line to downstream connector
11 DM_IN I/O D– data line to downstream connector
12 OUT P Power-switch output
13 FAULT O Active-low open-drain output, asserted during over-temperature or current limit conditions
14 GND P Ground connection
15 ILIM_LO I External resistor connection used to set the low current-limit threshold and the load detection current threshold. A resistor to ILIM_LO is optional; see the Current-Limit Settings section.
16 ILIM_HI I External resistor connection used to set the high current-limit threshold
NA PowerPAD™ Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect to GND plane.
(1) G = Ground, I = Input, O = Output, P = Power