JAJSN20 September   2021 TPS25854-Q1 , TPS25855-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Switching Characteristics
    8. 8.8 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1  Power Down or Undervoltage Lockout
      2. 10.3.2  Input Overvoltage Protection (OVP) - Continuously Monitored
      3. 10.3.3  Buck Converter
      4. 10.3.4  FREQ/SYNC
      5. 10.3.5  Bootstrap Voltage (BOOT)
      6. 10.3.6  Minimum ON-time, Minimum OFF-time
      7. 10.3.7  Internal Compensation
      8. 10.3.8  Current Limit and Short Circuit Protection
        1. 10.3.8.1 USB Switch Programmable Current Limit (ILIM)
        2. 10.3.8.2 Cycle-by-Cycle Buck Current Limit
        3. 10.3.8.3 OUT Current Limit
      9. 10.3.9  Cable Compensation
      10. 10.3.10 Thermal Management With Temperature Sensing (TS) and OTSD
      11. 10.3.11 Thermal Shutdown
      12. 10.3.12 FAULT Indication
      13. 10.3.13 USB Specification Overview
      14. 10.3.14 USB Type-C® Basics
        1. 10.3.14.1 Configuration Channel
        2. 10.3.14.2 Detecting a Connection
        3. 10.3.14.3 Plug Polarity Detection
      15. 10.3.15 USB Port Operating Modes
        1. 10.3.15.1 USB Type-C® Mode
        2. 10.3.15.2 Dedicated Charging Port (DCP) Mode
          1. 10.3.15.2.1 DCP BC1.2 and YD/T 1591-2009
          2. 10.3.15.2.2 DCP Divider-Charging Scheme
          3. 10.3.15.2.3 DCP 1.2-V Charging Scheme
        3. 10.3.15.3 DCP Auto Mode
    4. 10.4 Device Functional Modes
      1. 10.4.1 Shutdown Mode
      2. 10.4.2 Active Mode
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Output Voltage Setting
        2. 11.2.2.2 Switching Frequency
        3. 11.2.2.3 Inductor Selection
        4. 11.2.2.4 Output Capacitor Selection
        5. 11.2.2.5 Input Capacitor Selection
        6. 11.2.2.6 Bootstrap Capacitor Selection
        7. 11.2.2.7 Undervoltage Lockout Set-Point
        8. 11.2.2.8 Cable Compensation Set-Point
        9. 11.2.2.9 FAULT, POL, and THERM_WARN Resistor Selection
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
    3. 13.3 Ground Plane and Thermal Considerations
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 サポート・リソース
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4 Thermal Information

THERMAL METRIC(1) (2) TPS2585x-Q1 UNIT
RPQ (VQFN)
25 PINS
RθJA Junction-to-ambient thermal resistance 37.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.2 °C/W
RθJB Junction-to-board thermal resistance 8.8 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 8.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 20.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Power rating at a specific ambient temperature TA should be determined with a maximum junction temperature of 150 °C.