JAJSET9B October   2017  – September 2019 TPS27S100

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     代表的なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements – Current Monitor Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Accurate Current Monitor
      2. 7.3.2 Adjustable Current Limit
      3. 7.3.3 Inductive-Load Switching-Off Clamp
      4. 7.3.4 Full Protections and Diagnostics
        1. 7.3.4.1 Short-to-GND and Overload Detection
        2. 7.3.4.2 Open-Load Detection
        3. 7.3.4.3 Short-to-Supply Detection
        4. 7.3.4.4 Thermal Fault Detection
        5. 7.3.4.5 UVLO Protection
        6. 7.3.4.6 Loss of GND Protection
        7. 7.3.4.7 Reverse Current Protection
        8. 7.3.4.8 Protection for MCU I/Os
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Without a GND Network
      2. 10.2.2 With a GND Network
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 コミュニティ・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.3.4.4 Thermal Fault Detection

To protect the device in severe power stressing cases, the device implements two types of thermal fault detection, absolute temperature protection (thermal shutdown) and dynamic temperature protection (thermal swing). Respective temperature sensors are integrated close to each power FET, so the thermal fault is reported by each channel. This arrangement can help the device keep the cross-channel effect to a minimum when some channels are in a thermal fault condition.

Thermal shutdown is active when the absolute temperature TJ > T(SD). When thermal shutdown occurs, the respective output turns off.

Thermal swing activates when the power FET temperature is increasing sharply, that is, when ΔT = T(FET) – T(Logic) > T(sw), then the output turns off. The output automatically recovers and the fault signal clears when ΔT = T(FET) – T(Logic) < T(sw) – T(hys). Thermal swing function improves the device reliability when subjected to repetitive fast thermal variation.

TPS27S100 Image14.gifFigure 30. Thermal Behavior Diagram