SNVSCN2 September   2024 TPS37100-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (VDD)
        1. 7.3.1.1 Undervoltage Lockout (VPOR < VDD < UVLO)
        2. 7.3.1.2 Power-On Reset (VDD < VPOR )
      2. 7.3.2 SENSE
        1. 7.3.2.1 Adjustable Voltage Thresholds
        2. 7.3.2.2 SENSE Hysteresis
        3. 7.3.2.3 Reverse Polarity Protection
      3. 7.3.3 Output Logic Configurations
        1. 7.3.3.1 Open-Drain
        2. 7.3.3.2 Active-Low (OUT A and OUT B)
        3. 7.3.3.3 Latching
      4. 7.3.4 User-Programmable Release Time Delay
        1. 7.3.4.1 Deassertion Time Delay Configuration
      5. 7.3.5 User-Programmable Sense Delay
        1. 7.3.5.1 Sense Time Delay Configuration
      6. 7.3.6 Analog Out
      7. 7.3.7 Built-in Self-Test
        1. 7.3.7.1 Latching
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design 1: Off-Battery Monitoring
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Dissipation and Device Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Creepage Distance
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4.1 Layout Guidelines

  • Make sure that the connection to the VDD pin is low impedance. Good analog design practice is to place a greater than 0.1µF ceramic capacitor as near as possible to the VDD pin.
  • To further improve the noise immunity on the SENSE pins, either use the CTS feature with a 100pF capacitor or place a 10nF to 100nF capacitor on the SENSE pin.
  • If a capacitor is used on CTS or CTR, place these components as close as possible to the respective pins. If the capacitor adjustable pins are left unconnected, make sure to minimize the amount of parasitic capacitance on the pins to less than 20pF as this affects the delay of CTS and CTR.
  • To further improve the noise immunity on the SENSE pins, either use the CTS feature with a 100pF capacitor or place a 10nF to 100nF capacitor on the SENSE pin.
  • Place the AOUT stability capacitor as close as possible to the pin.
  • For the open-drain outputs, place the pull-up resistors on OUT A, OUT B, and BIST as close to the pin as possible.
  • When laying out metal traces, separate high voltage traces from low voltage traces as much as possible. If high and low voltage traces need to run close by, spacing between traces must be greater than 20mils (0.5mm).
  • Do not have high voltage metal pads or traces closer than 20mils (0.5mm) to the low voltage metal pads or traces.