JAJSH97A April   2019  – September 2019 TPS3840-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション回路
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Voltage (VDD)
        1. 9.3.1.1 VDD Hysteresis
        2. 9.3.1.2 VDD Transient Immunity
      2. 9.3.2 User-Programmable Reset Time Delay
      3. 9.3.3 Manual Reset (MR) Input
      4. 9.3.4 Output Logic
        1. 9.3.4.1 RESET Output, Active-Low
        2. 9.3.4.2 RESET Output, Active-High
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Operation (VDD > VDD(min))
      2. 9.4.2 VDD Between VPOR and VDD(min)
      3. 9.4.3 Below Power-On-Reset (VDD < VPOR)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design 1: Dual Rail Monitoring with Power-Up Sequencing
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Design 2: Automotive Off-Battery Monitoring
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves: TPS3840EVM
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイスの項目表記
    2. 13.2 コミュニティ・リソース
    3. 13.3 商標
    4. 13.4 静電気放電に関する注意事項
    5. 13.5 Glossary
  14. 14メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.4 Thermal Information

THERMAL METRIC(1) TPS3840 UNIT
DBV (SOT23-5)
5 PINS
RθJA Junction-to-ambient thermal resistance 187.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 109.2 °C/W
RθJB Junction-to-board thermal resistance 92.8 °C/W
ψJT Junction-to-top characterization parameter 35.4 °C/W
ψJB Junction-to-board characterization parameter 92.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.