JAJSU21 April   2024 TPS3842

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specification
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagram
  8. 7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 SENSE Input
        1. 8.3.1.1 SENSE Hysteresis
      2. 8.3.2 Selecting the SENSE Delay Time
      3. 8.3.3 Selecting the RESET Delay Time
      4. 8.3.4 RESET Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VDD(min))
      2. 8.4.2 Above Power-On Reset but Less Than VDD(min) (VPOR < VDD < VDD(min))
      3. 8.4.3 Below Power-On Reset (VDD < VPOR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Meeting the Sense and Reset Delay
      3. 9.2.3 Application Curve
      4. 9.2.4 Power Supply Recommendations
      5. 9.2.5 Layout
        1. 9.2.5.1 Layout Guidelines
        2. 9.2.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 Trademarks
    3. 10.3 静電気放電に関する注意事項
    4. 10.4 サポート・リソース
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS3842 UNIT
DRL
6 PINS
RθJA Junction-to-ambient thermal resistance 153.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 86.3 °C/W
RθJB Junction-to-board thermal resistance 42.8 °C/W
ΨJT Junction-to-top characterization parameter 2.9 °C/W
ΨJB Junction-to-board characterization parameter 41.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.