JAJS234H MARCH   2007  – May 2019 TPS40192 , TPS40193

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Voltage Reference
      2. 8.3.2  Oscillator
      3. 8.3.3  UVLO
      4. 8.3.4  Enable Functionality
      5. 8.3.5  Start-Up Sequence and Timing
      6. 8.3.6  Selecting the Short Circuit Current
      7. 8.3.7  5-V Regulator
      8. 8.3.8  Prebias Start-Up
      9. 8.3.9  Drivers
      10. 8.3.10 Power Good
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Continuous Conduction Mode
      2. 8.4.2 Low-Quiescent Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Selecting the Switching Frequency
        2. 9.2.2.2  Inductor Selection
        3. 9.2.2.3  Output Capacitor Selection (C8)
        4. 9.2.2.4  Peak Current Rating of the Inductor
        5. 9.2.2.5  Input Capacitor Selection (C7)
        6. 9.2.2.6  MOSFET Switch Selection (Q1, Q2)
        7. 9.2.2.7  Boot Strap Capacitor
        8. 9.2.2.8  Input Bypass Capacitor (C6)
        9. 9.2.2.9  BP5 Bypass Capacitor (C5)
        10. 9.2.2.10 Input Voltage Filter Resistor (R11)
        11. 9.2.2.11 Short Circuit Protection (R9)
        12. 9.2.2.12 Feedback Compensation (Modeling the Power Stage)
        13. 9.2.2.13 Feedback Divider (R7, R8)
        14. 9.2.2.14 Error Amplifier Compensation (R6, R10, C1, C2, C3)
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
        1. 12.1.1.1 関連デバイス
      2. 12.1.2 デバイスの項目表記
    2. 12.2 ドキュメントのサポート
    3. 12.3 関連リンク
    4. 12.4 ドキュメントの更新通知を受け取る方法
    5. 12.5 コミュニティ・リソース
    6. 12.6 商標
    7. 12.7 静電気放電に関する注意事項
    8. 12.8 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11.1 Layout Guidelines

  • Optionally use R11 as a VDD filter resistor
  • Locate the bypass capacitors (C7) near the power MOSFETs.
  • Terminate signal components to a signal ground island separate from power ground
  • Connect signal ground island to thermal pad with a single 10-mil wide trace.
  • Connect power ground to the source of the synchronous rectifier.
  • The thermal pad serves as the only ground for the controller.
  • PowerPAD must be connected to signal ground and power ground at a single point only. Connect the PowerPad to the system ground.
  • PowerPad™ should be directly connected to SYNC MOSFET (Q3) source with short, wide trace.
  • Locate 3-5 vias in PowerPad™ land to remove heat from the device.
  • Connect input capacitors (C7 and C9) and output capacitors (C8 andC10) grounds directly to SYNC MOSFET (Q3) source with wide copper trace or solid power ground island.
  • Locate input capacitors (C7 and C9), MOSFETs (Q2 and Q3), inductor (L1) and output capacitor (C8 andC10) over power ground island.
  • Use short, wide traces for LDRV and HDRV MOSFET connections.
  • Route SW trace near HDRV trace.
  • Route GND trace near LDRV trace.
  • Use separate analog ground island under feedback components (C1, C2, C3, R5, R6, R7, R8 and R10).
  • Connect ground islands at PowerPad™ with 10-mil wide trace opposite SYNC MOSFET (Q2) source connection.