SLUSAF8E July   2011  – January 2016 TPS40322

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Reference
      2. 7.3.2  Output Voltage Setting
      3. 7.3.3  Input Voltage Feedforward
      4. 7.3.4  Current Sensing
      5. 7.3.5  Overcurrent Protection
      6. 7.3.6  Two-Phase Mode, Remote Sense Amplifier, and Current Sharing Loop
      7. 7.3.7  Start-Up and Shutdown
        1. 7.3.7.1 Start-Up Sequence
        2. 7.3.7.2 Prebiased Output Start-Up
        3. 7.3.7.3 Shutdown
      8. 7.3.8  Switching Frequency and Master or Slave Synchronization
      9. 7.3.9  Overvoltage and Undervoltage Fault Protection
      10. 7.3.10 Input Undervoltage Lockout (UVLO)
      11. 7.3.11 Power Good
      12. 7.3.12 Thermal Shutdown
      13. 7.3.13 Connection of Unused Pins
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Dual-Output Configuration from 12-V Nominal to 1.2-V and 1.8-V DC-to-DC Converter Using the TPS40322
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Selecting a Switching Frequency
          2. 8.2.1.2.2  Inductor Selection (L1)
          3. 8.2.1.2.3  Output Capacitor Selection (C10 through C16)
          4. 8.2.1.2.4  Peak Current Rating of Inductor
          5. 8.2.1.2.5  Input Capacitor Selection (C3 through C6)
          6. 8.2.1.2.6  MOSFET Selection (Q1)
          7. 8.2.1.2.7  ILIM Resistor (R2)
          8. 8.2.1.2.8  Feedback Divider (R10, R14)
          9. 8.2.1.2.9  Compensation: (R11, R12, C17, C19, C21)
          10. 8.2.1.2.10 Boot-Strap Capacitor (C7)
          11. 8.2.1.2.11 General Device Components
            1. 8.2.1.2.11.1 Synchronization (SYNC Pin)
            2. 8.2.1.2.11.2 RT Resistor (R6)
            3. 8.2.1.2.11.3 Differential Amplifier Out (DIFFO Pin)
            4. 8.2.1.2.11.4 EN/SS Timing Capacitors (C8)
            5. 8.2.1.2.11.5 Power Good (PG1, PG2 Pins)
            6. 8.2.1.2.11.6 Phase Set (PHSET Pin)
            7. 8.2.1.2.11.7 UVLO Programming Resistors (R1 and R3)
            8. 8.2.1.2.11.8 VDD Bypass Capacitor (C2)
            9. 8.2.1.2.11.9 VBP6 Bypass Capacitor (C18)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Two-Phase, Single Output Configuration from 12-V nominal to 1.2-V DC-to-DC Converter Using the TPS40322
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Stage
      2. 10.1.2 Device Peripheral
      3. 10.1.3 Thermal Pad Layout
    2. 10.2 Layout Example
    3. 10.3 Mounting and Thermal Profile Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8 Applications and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPS40322 is a dual-output, synchronous buck controller, and it can also be configured as a two-phase controller.

8.2 Typical Applications

8.2.1 Dual-Output Configuration from 12-V Nominal to 1.2-V and 1.8-V DC-to-DC Converter Using the TPS40322

This section explains the design process and component selection for a dual output synchronous buck converter using TPS40322 controller. The design goal parameters are listed in Table 3. The design procedure provides calculations for channel 1 only. User can apply similar calculation for channel 2.

Figure 23 shows the dual output converter schematic for this design example.

TPS40322 des_ex1_sch_lusaf8.gif Figure 23. Design Example 1, Dual Output Converter Schematic

8.2.1.1 Design Requirements

The design goal parameters are listed in Table 3.

Table 3. TPS40322 Dual Output Design Example Specification

PARAMETER TEST CONDITION MIN TYP MAX UNIT
INPUT CHARACTERISTICS
VIN Input voltage 8 12 15 V
VIN(ripple) Input ripple IOUT1 = IOUT2 = 10 A 0.25 V
OUTPUT 1 CHARACTERISTICS
VOUT1 Output voltage IOUT1(min) ≤ IOUT1 ≤ IOUT1(max) 1.2 V
Line regulation VIN(min) ≤ VIN ≤ VIN(max) 0.5%
Load regulation IOUT1(min) ≤ IOUT1 ≤ IOUT1(max) 0.5%
VRIPPLE1 Output ripple IOUT1 = IOUT1(max) 24 mV
VOVER1 Output overshoot ΔIOUT1 = 5 A 40 mV
VUNDER1 Output undershoot ΔIOUT1 = 5A 40 mV
IOUT1 Output current VIN(min) ≤ VIN ≤ VIN(max) 0 10 A
ISCP1 Short circuit current trip point 15 A
OUTPUT 2 CHARACTERISTICS
VOUT2 Output voltage IOUT2(min) ≤ IOUT2 ≤ IOUT2(max) 1.8 V
Line regulation VIN(min) ≤ VIN ≤ VIN(max) 0.5%
Load regulation IOUT2(min) ≤ IOUT2 ≤ IOUT2(max) 0.5%
VRIPPLE2 Output ripple IOUT2 = IOUT2(max) 36 mV
VOVER2 Output overshoot ΔIOUT2 = 5 A 40 mV
VUNDER2 Output undershoot ΔIOUT2 = 5 A 40 mV
IOUT2 Output current VIN(min) ≤ VIN ≤ VIN(max) 0 10 A
ISCP2 Short circuit current trip point 15 A
GENERAL CHARACTERSTICS
tSS Soft-start time VIN = 12 V 2 ms
η Efficiency VIN = 12 V, IOUT1= IOUT2 = 10 A 88%
fSW Switching frequency 500 kHz

8.2.1.2 Detailed Design Procedure

Inductor Selection (L1) through General Device Components show equations and calculations regarding VOUT1. VOUT2 values can be calculated using similar equations. See Table 4 for the list of materials.

Table 4. Design Example 1, Dual-Output List of Materials

REFERENCE
DESIGNATOR		 QTY DESCRIPTION PART NUMBER MFR
C1 1 Capacitor, Aluminum, 100 µF, 35 V, ±20%, 0.328 x 0.328 inch EEV-FK1V101GP Panasonic - ECG
C2, C7, C20, C26, C39 5 Capacitor, Ceramic, 0.1 µF, 50 V, X7R, ±10%, 0603 Std Std
C3, C35 2 Capacitor, Ceramic, 0.1 µF, 25 V, X5R, ±10%, 0402 Std Std
C4, C36 2 Capacitor, Ceramic, 1.0 µF, 25 V, X7R, ±10%, 0603 Std Std
C5, C6, C37, C38 4 Capacitor, Ceramic, 10 µF, 25 V, X5R, ±10%, 0805 Std Std
C8, C25 2 Capacitor, Ceramic, 33 nF, 16 V, X7R, ±10%, 0603 Std Std
C9, C19, C22, C34 4 Capacitor, Ceramic, 470 pF, 25 V, C0G, NP0, ±5%, 0603 Std Std
C10, C27 2 Capacitor, Ceramic, 1.0 µF, 6.3 V, X5R, ±10%, 0402 Std Std
C11, C12, C18, C28, C29 5 Capacitor, Ceramic, 3.3 µF, 10 V, X5R, ±10%, 0603 C1608X5R1A335K TDK Corporation
C13, C14, C30, C31 4 Capacitor, Ceramic, 10 µF, 6.3 V, X7R, ±10%, 0805 Std Std
C15, C16, C32, C33 4 Capacitor, Polymer Aluminum, 220 µF, 4 V, ±20%, 5 mΩ ESR EEF-SE0G221ER Panasonic - ECG
C17, C23 2 Capacitor, Ceramic, 220 pF, 50 V, C0G, NP0, ±5%, 0603 Std Std
C21, C24 2 Capacitor, Ceramic, 10 pF, 50 V, C0G, NP0, ±5%, 0603 Std Std
C40 1 Capacitor, Ceramic, 1.0 nF, 25 V, C0G, NP0, ±5%, 0603 Std Std
L1, L2 2 Inductor, Power Choke, 1.1 µH, ±20%, 3.15 mΩ, 7.0 mm x 6.9 mm 744314110 Wurth Elektronik
Q1, Q2 2 MOSFET, Synchronous Buck NexFET Power Block, QFN-8 POWER CSD86330Q3D Texas Instruments
R1 1 Resistor, Chip, 68.1 kΩ, 1/10 W, ±1%, 0603 Std Std
R2, R21 2 Resistor, Chip, 86.6 kΩ, 1/10 W, ±1%, 0603 Std Std
R3 1 Resistor, Chip, 12.7 kΩ, 1/10 W, ±1%, 0603 Std Std
R4, R5, R22 3 Resistor, Chip, 1.00 Ω, 1/10 W, ±1%, 0603 Std Std
R6 1 Resistor, Chip, 40.2 kΩ, 1/10 W, ±1%, 0603 Std Std
R7, R24 2 Resistor, Chip, 49.9 Ω, 1/10 W, ±1%, 0603 Std Std
R8, R17 2 Resistor, Chip, 5.11 Ω, 1/8 W, ±1%, 0805 Std Std
R9, R16 2 Resistor, Chip, 0 Ω, 1/10 W, ±1%, 0603 Std Std
R10, R14, R19, R27 4 Resistor, Chip, 20.0 kΩ, 1/10 W, ±1%, 0603 Std Std
R11, R18 2 Resistor, Chip, 82.5 kΩ, 1/10 W, ±1%, 0603 Std Std
R12, R23 2 Resistor, Chip, 1.62 kΩ, 1/10 W, ±1%, 0603 Std Std
R13 1 Resistor, Chip, 3.09 kΩ, 1/10 W, ±1%, 0603 Std Std
R15 1 Resistor, Chip, 29.4 kΩ, 1/10 W, ±1%, 0603 Std Std
R20, R30 2 Resistor, Chip, 5.11 Ω, 1/10 W, ±1%, 0603 Std Std
R25 1 Resistor, Chip, 10.0 kΩ, 1/10 W, ±1%, 0603 Std Std
R26 1 Resistor, Chip, 3.24 kΩ, 1/10 W, ±1%, 0603 Std Std
R28, R29 2 Resistor, Chip, 100 kΩ, 1/10 W, ±1%, 0603 Std Std
U1 1 TPS40322 Dual Synchronous Buck Controller, QFN-32 TPS40322RHB Texas Instruments

8.2.1.2.1 Selecting a Switching Frequency

To maintain acceptable efficiency and meet minimum on-time requirements, a 500-kHz switching frequency is selected.

8.2.1.2.2 Inductor Selection (L1)

Synchronous BUCK power inductors are typically sized for approximately 20%–40% peak-to-peak ripple current (IRIPPLE). Given a target ripple current of 30%, the required inductor size, at maximum rated output current, can be calculated using Equation 8.

Equation 8. TPS40322 de1q_l1_lusaf8.gif

Selecting a standard, readily available inductor, with a rated inductance is 0.88 µH at 10 A, IRIPPLE1 = 2.5 A.

The RMS current through the inductor is approximated by the equation:

Equation 9. TPS40322 de1q_il1rms_lusaf8.gif

8.2.1.2.3 Output Capacitor Selection (C10 through C16)

The selection of the output capacitor is typically driven by the output transient response requirement. Equation 10 and Equation 11 over-estimate the voltage deviation to account for delays in the loop bandwidth and can be used to determine the required output capacitance:

Equation 10. TPS40322 de1q_vover1_lusaf8.gif
Equation 11. TPS40322 de1q_vunder1_lusaf8.gif

When VIN(min) > 2 x VOUT1, use the overshoot equation, VOVER1, to calculate minimum output capacitance. When VIN(min) < 2 x VOUT1 use Equation 11, VUNDER1, to calculate minimum output capacitance. In this design example, VIN(min) is much larger than 2 x VOUT1 so Equation 12 is used to determine the required minimum output capacitance.

Equation 12. TPS40322 de1q_cout1min_lusaf8.gif

With a minimum capacitance, the maximum allowable ESR is determined by the maximum ripple voltage and is approximated by Equation 13.

Equation 13. TPS40322 de1q_esrmax_lusaf8.gif

Two 220-µF, 4-V, aluminum electrolytic capacitors were chosen for load response requirements. Additionally two 0805 10-µF, X7R, along with two 0603, 3.3-µF X5R, and one 1-µF, X5R ceramic capacitors are selected for low ESR and high frequency decoupling.

8.2.1.2.4 Peak Current Rating of Inductor

With the output capacitance known, it is possible to calculate the charge current during start-up and determine the minimum saturation current rating for the inductor. The start-up charging current is approximated using Equation 14.

Equation 14. TPS40322 de1q_icharge_lusaf8.gif
Equation 15. TPS40322 de1q_il1peak_lusaf8.gif

Table 5. Inductor Requirements Summary

PARAMETER VALUE UNIT
L1 Inductance 0.88 µH
IL1_RMS RMS current (thermal rating) 10.026 A
IL1_PEAK Peak current (saturation rating) 11.53 A

A 744314110 from Wurth Electronics with 1.1-µH zero current inductance is selected. Inductance for this part is 0.88-µH at 10-A bias. This 15-A, 3.15-mΩ inductor exceeds the minimum inductor ratings in a 7-mm x 7-mm package.

8.2.1.2.5 Input Capacitor Selection (C3 through C6)

The input voltage ripple is divided between the capacitance and ESR of the input capacitor. For this design VRIPPLE(cap) = 200 mV and VRIPPLE(esr) = 50 mV. The minimum capacitance and maximum ESR are estimated using Equation 16.

Equation 16. TPS40322 de1q_cin1min_lusaf8.gif
Equation 17. TPS40322 de1q_esrmax2_lusaf8.gif

The RMS current in the input capacitors is estimated using Equation 18.

Equation 18. TPS40322 de1q_irmscin1_lusaf8.gif
Equation 19. TPS40322 de1q_d_lusaf8.gif

To achieve these goals, two 0805, 10-µF capacitors, one 0605, 1.0-µF capacitor and one 0402, 0.1-µF X5R ceramic capacitor are combined at the input.

8.2.1.2.6 MOSFET Selection (Q1)

Texas Instruments CSD86330, 20-A power block device was chosen. This device incorporates the high-side and low-side MOSFETs in a single 3 mm x 3 mm package. The high-side MOSFET has an on-resistance (RDS(on)) of 8.8 mΩ, while the low-side on-resistance (RDS(on)) is 4.6 mΩ, both at 4.5 V gate voltage. A 5.11-Ω gate resistor is used on the HDRV pin on each device for added noise immunity.

8.2.1.2.7 ILIM Resistor (R2)

The output current is sensed across the DCR of the L1 output inductor. An RC combination having a time constant equal to that of the L1 inductance and the DCR is used to extract the current information as a voltage. A standard capacitor value of 0.1-µF is used. The resistor, R13, can be calculated using Equation 20.

Equation 20. TPS40322 q_r13_lusaf8.gif

A standard 3.09-kΩ resistor was selected.

This design limits the maximum voltage drop across the current sense inputs, VCS(max), to 50 mV. If the voltage drop across the DCR of the inductor is greater than VCS(max), after allowing for 20% overshoot spikes and a 20% variation in the DCR value, then a resistor is added to divide the voltage down to 50 mV. The divider resistor, R15, is calculated by Equation 21.

Equation 21. TPS40322 q_r15_lusaf8.gif

where

  • VDCR = (DCR × 1.2) × (IL(peak) × 1.2)

The maximum DCR voltage drop is given by Equation 22.

Equation 22. TPS40322 de1q_voc_lusaf8.gif

The current limit resistor is calculated using the minimum ILIM programming current, IILIM(min), the maximum current sense amplifier gain, ACS, and assuming a current sense amplifier minimum input offset voltage, VOS(min) equal to –3 mV.

Equation 23. TPS40322 de1_q_rilim_lusaf8.gif

8.2.1.2.8 Feedback Divider (R10, R14)

The TPS40322 controller uses a full operational amplifier with an internally fixed 0.600-V reference. Tha value for R10 is selected between 10-kΩ and 50-kΩ for a balance of feedback current and noise immunity. With the R10 resistor set to 20-kΩ, the output voltage is programmed with a resistor divider given by Equation 24.

Equation 24. TPS40322 de1q_r14_lusaf8.gif

8.2.1.2.9 Compensation: (R11, R12, C17, C19, C21)

Using the TPS40k Loop Stability Tool for an 85-kHz bandwidth and 50° of phase margin with an R10 value of 20.0 kΩ, and measuring the theoretical results in the laboratory and modifying accordingly for system optimization yields the following values:

  • C21 = 10 pF
  • C17 = 220 pF
  • C19 = 470 pF
  • R12 = 4.42 kΩ
  • R11 = 82.5 kΩ

8.2.1.2.10 Boot-Strap Capacitor (C7)

To ensure proper charging of the high-side FET gate, limit the ripple voltage on the boost capacitor to < 100 mV.

Equation 25. TPS40322 de1q_cboost_lusaf8.gif

8.2.1.2.11 General Device Components

8.2.1.2.11.1 Synchronization (SYNC Pin)

The SYNC pin must be left open for independent dual outputs.

8.2.1.2.11.2 RT Resistor (R6)

The desired switching frequency is programmed by the current through RRT to GND. the value of RRT is calculated using Equation 26.

Equation 26. TPS40322 de1q_rrt_lusaf8.gif

8.2.1.2.11.3 Differential Amplifier Out (DIFFO Pin)

In dual output configuration the DIFFO pin is not used and must remain open (unconnected).

8.2.1.2.11.4 EN/SS Timing Capacitors (C8)

The soft-start capacitor provides smooth ramp of the error amplifier reference voltage for controlled start-up. The soft-start capacitor is selected using Equation 27.

Equation 27. TPS40322 de1q_css_lusaf8.gif

8.2.1.2.11.5 Power Good (PG1, PG2 Pins)

PG1 and PG2 can each be pulled up to BP6 through a 100-kΩ resistor, or remain not-connected. For sequencing the start-up of output 1 before output 2, connect PG1 to EN2/SS2; for sequencing the start-up of output 2 before output 1, connect PG2 to EN1/SS1.

8.2.1.2.11.6 Phase Set (PHSET Pin)

The PHSET pin can be connected to ground or connected to the BP6 pin.

8.2.1.2.11.7 UVLO Programming Resistors (R1 and R3)

The UVLO hysteresis level is programmed by R1 with Equation 28 and Equation 29.

Equation 28. TPS40322 de1q_ruvlohys_lusaf8.gif
Equation 29. TPS40322 de1q_ruvloset_lusaf8.gif

8.2.1.2.11.8 VDD Bypass Capacitor (C2)

As shown in the Pin Configuration and Functions section, use a 0.1-µF, 50-V, X7R capacitor for VDD bypass.

8.2.1.2.11.9 VBP6 Bypass Capacitor (C18)

Select a 3.3-µF (or greater) low ESR capacitor for BP6. For this design use a 3.3-µF, X5R ceramic capacitor.

8.2.1.3 Application Curves

TPS40322 eff_12v_lusaf8.png Figure 24. Efficiency vs Load Current (8 V to 15 V to 1.2 V at 10 A, Design Example 1)
TPS40322 vout1.png Figure 26. Design Example 1 Loop Response
VIN = 12 V, VOUT1 = 1.2 V, IOUT1 = 10 A, 80-kHz Bandwidth, 50° Phase Margin
TPS40322 eff_18v_lusaf8.png Figure 25. Efficiency vs Load Current (8 V to 15 V to 1.8 V at 10 A, Design Example 1)
TPS40322 vout2.png Figure 27. Design Example 1 Loop Response
VIN = 12 V, VOUT2 = 1.8 V, IOUT2 = 10 A, 80-kHz Bandwidth, 50° Phase Margin

Figure 28 shows the switching waveform, VIN = 12 V, IOUT1 = IOUT2 = 10 A, Ch.1 = HDRV1, Ch.2 = LDRV1, Ch.3 = VOUT1 ripple. The high-frequency noise is caused by parasitic inductive and capacitive elements interacting with the high energy, rapidly switching power elements resulting in ringing at the transition points. Capacitive filtering at the load input will successfully attenuate these noise spikes.

TPS40322 de_switchingwave_lusaj8.gif Figure 28. Design Example 1 Switching Waveform

8.2.2 Two-Phase, Single Output Configuration from 12-V nominal to 1.2-V DC-to-DC Converter Using the TPS40322

Figure 29 shows the schematic, waveforms, and components for a two-phase, single output synchronous buck converter using the TPS40322 controller. The design goal parameters are given in Table 7.

Table 6 summaries the channel 2 related pin connection in two-phase mode.

TPS40322 des_ex2_sch_lusaf8.gif Figure 29. Design Example 2, Two-Phase Converter Schematic

Table 6. Channel 2 Pin Connections in Two-Phase Mode

PIN NAME CONNECTION
COMP2 Connect to COMP1
EN2/SS2/GSNS Use as GSNS pin, connect to the output ground
FB2 Connect to BP6
ILIM2/VSNS Use as VSNS pin, connect to output
PG2 Floating or connect to ground

8.2.2.1 Design Requirements

The design goal parameters are listed in Table 7.

Table 7. TPS40322 Design Example 2 Specification

PARAMETER TEST CONDITION MIN TYP MAX UNIT
VIN Input voltage 4.5 15 V
VOUT Output voltage IOUT(min) ≤ IOUT ≤ IOUT(max) 1.2 V
Line regulation VIN(min) ≤ VIN ≤ VIN(max) 0.5%
Load regulation IOUT(min) ≤ IOUT ≤ IOUT(max) 0.5%
VRIPPLE Output ripple IOUT1 = IOUT1(max) 12 mV
VOVER Output overshoot ΔIOUT1 = 5 A 40 mV
VUNDER Output undershoot ΔIOUT1 = 5A 40 mV
IOUT Output current VIN(min) ≤ VIN ≤ VIN(max) 0 30 A
tSS Soft-start time VIN = 12 V 2 ms
η Efficiency VIN = 12 V, IOUT1 = IOUT2 = 10 A 88%
fSW Switching frequency 500 kHz

8.2.2.2 Detailed Design Procedure

Inductor Selection (L1) through General Device Components show equations and calculations regarding VOUT1. VOUT2 values can be calculated using similar equations. See Table 8 for the list of materials.

Table 8. TPS40322 Design Example 2, Two-Phase, Single Output Bill of Materials

REFERENCE
DESIGNATOR		 QTY DESCRIPTION PART NUMBER MFR
C1, C2, C3, C31, C32, C33 6 Capacitor, Ceramic, 22 µF, 25 V, X5R, ±20%, 1210 Std Std
C4, C18, C28, C30 4 Capacitor, Ceramic, 1 µF, 50 V, X7R, ±10%, 0603 Std Std
C5, C6, C7, C22, C29 5 Capacitor, Ceramic, 0.1 µF, 50 V, X7R, ±10%, 0603 Std Std
C8, C21 2 Capacitor, Ceramic, 6.8 nF, 50 V, X7R, ±10%, 0805 Std Std
C9 1 Capacitor, Ceramic, 2.2 nF, 16 V, X7R, ±10%, 0603 Std Std
C10, C11, C12, C13, C23, C24, C25, C26 8 Capacitor, Polymer Aluminum, 220 µF, 4 V, ±20%, 5mΩ ESR EEFSE0G221R Panasonic - ECG
C14, C27 2 Capacitor, Ceramic, 22 µF, 6.3 V, X5R, ±10%, 0805 Std Std
C15 1 Capacitor, Ceramic, 8.2 nF, 16 V, X7R, ±10%, 0603 Std Std
C16 1 Capacitor, Ceramic, 330 pF, 16 V, X7R, ±10%, 0603 Std Std
C17 1 Capacitor, Ceramic, 22 nF, 50 V, X7R, ±10%, 0603 Std Std
C19, C20 2 Capacitor, Ceramic, 4.7 µF, 16 V, X7R, ±10%, 0805 Std Std
C38, C39 2 Capacitor, Aluminum, 100 µF, 25 V, ±20%, F8 ECE-V1EA101XP Panasonic - ECG
L1, L2 2 Inductor, SMT, 0.47 µH, ±20%, 1.2 mΩ, 0.512" x 0.571" IHLP5050FDERR47M01 Vishay/Dale
Q1, Q4 2 MOSFET, N-channel, 30 V, 30 A, 8 mΩ, 5-LFPAK RJK0305 Renesas Electronics
Q2, Q3 2 MOSFET, N-channel, 30 V, 60 A, 2.1 mΩ, 5-LFPAK RJK0328 Renesas Electronics
R1 1 Resistor, Chip, 42 kΩ, 1/10 W, ±1%, 0603 Std Std
R2 1 Resistor, Chip, 100 kΩ, 1/10 W, ±1%, 0603 Std Std
R3, R19 2 Resistor, Chip, 4.7 kΩ, 1/10 W, ±1%, 0603 Std Std
R4 1 Resistor, Chip, 38.5 kΩ, 1/10 W, ±1%, 0603 Std Std
R5 1 Resistor, Chip, 49.9 Ω, 1/10 W, ±1%, 0603 Std Std
R6, R8, R16 3 Resistor, Chip, 10 kΩ, 1/10 W, ±1%, 0603 Std Std
R7, R27, R28, R29, R30 5 Resistor, Chip, 0 Ω, 1/10 W, ±1%, 0603 Std Std
R9 1 Resistor, Chip, 511 Ω, 1/10 W, ±1% Std Std
R10, R17 1 Resistor, Chip, 1.00 Ω, 1/8 W, ±1%, 0805 Std Std
R11, R18 2 Resistor, Chip, 5.11 Ω, 1/10 W, ±1% 0603 603 Std
R12, R13 2 Resistor, Chip, 51 Ω, 1/10 W, ±1%, 0603 Std Std
R14 1 Resistor, Chip, 3.32 kΩ, 1/10 W, ±1%, 0603 Std Std
R15 1 Resistor, Chip, 40 kΩ, 1/10 W, ±1%, 0603 Std Std
R26, R31 2 Resistor, Chip, 2 Ω, 1/10 W, ±1%, 0603 Std Std
R20, R21, R22, R23, R24, R25, 0 not used Std Std
U1 1 Dual synchronous buck controller, QFN-32 TPS40322RHB Texas Instruments

8.2.2.3 Application Curves

TPS40322 wave1_lusaf8.gif
Figure 30. Steady-State Switching and Current Sharing
TPS40322 load_reg_lusaf8.gif
Figure 32. Load Regulation
TPS40322 line_reg_lusaf8.gif
Figure 31. Line Regulation