SLVSH18 December 2024 TPS4HC120-Q1
PRODUCTION DATA
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
INPUT VOLTAGE AND CURRENT | |||||||
VUVLOR | VBB undervoltage lockout rising | Measured with respect to the GND pin of the device | 3.2 | 3.6 | 4.0 | V | |
VUVLOF | VBB undervoltage lockout falling | 2.5 | 2.75 | 3.0 | V | ||
VClamp | VDS clamp voltage | TJ = 25°C | 35 | 43 | V | ||
TJ = –40°C to 150°C | 34 | 45 | V | ||||
VOUT,Clamp | VOUT clamp voltage | TJ = –40°C to 150°C | -31 | -23 | V | ||
IQ | Quiescent current all channels enabled | VBB ≤ 28V, VENx = VDIAG_EN = 5V, IOUTx = 0A | 3.8 | 4.5 | mA | ||
IQ,DIAG_DIS | Quiescent current channel enabled diagnostic disabled | VBB ≤ 28V VEN = 5V VDIA_EN = 0V, IOUTx = 0A |
VBB ≤ 28 V VEN = 5 V, VDIA_EN = 0 V, IOUTx = 0 A |
3.8 | 4.2 | mA | |
ISB | Current consumption in standby mode | VBB ≤ 18V, ISNS = 0mA VENx = 0V, VDIAG_EN = 5V, VOUT = 0V |
3.8 | 4.5 | mA | ||
tSTBY | Delay time to remain in standby mode before entering sleep mode | VENx = VDIAG_EN = 5V to 0V | 20 | ms | |||
ISLEEP | Sleep current (total device leakage including MOSFET channels) | VBB ≤ 18V, VENx = VDIAG_EN = 0V, VOUT = 0V | TA = 25°C | 0.5 | µA | ||
TA = 125°C | 2 | µA | |||||
IOUT(sleep) | Output leakage current per channel | VBB ≤ 18V, VENx = VDIAG_EN = 0V, VOUT = 0V | TA = 25°C | 0.01 | 0.2 | µA | |
TA = 125°C | 0.5 | µA | |||||
ILNOM | Continuous load current, per channel | All channels enabled | TA = 85°C | 2 | A | ||
One channel enabled | 3 | A | |||||
RON CHARACTERISTICS | |||||||
RON | On-resistance | 5V < VBB ≤ 28V, IOUT= 1A | TJ = 25°C | 120 | mΩ | ||
TJ = 150°C | 250 | mΩ | |||||
3V ≤ VBB ≤ 5V, IOUT =1A | TJ = 25°C | 175 | mΩ | ||||
TJ = 150°C | 280 | mΩ | |||||
ΔRON | Percentage difference in RON between channels | 5V < VBB ≤ 28V, IOUT= 1A | TJ = –40°C to 150°C | 5 | % | ||
RON(REV) | On-resistance during reverse polarity | –18V ≤ VBB ≤ –6V | TJ = 25°C | 120 | mΩ | ||
TJ = 150°C | 250 | mΩ | |||||
VF | Body diode forward conduction voltage | VEN = 0V IOUT = –0.1A | 0.8 | 1 | V | ||
CURRENT SENSE CHARACTERISTICS | |||||||
KSNS | Current sense ratio IOUT / ISNS |
IOUT = 1A | 1040 | ||||
ISNS | Current sense current and accuracy | VEN = VDIAG_EN = 5V | IOUT = 2A | 1.9 | mA | ||
–4 | 3 | % | |||||
IOUT = 1.5A | 1.43 | mA | |||||
–4 | 3 | % | |||||
IOUT = 750mA | 0.72 | mA | |||||
–4 | 4 | % | |||||
IOUT = 300mA | 0.29 | mA | |||||
–5 | 5 | % | |||||
IOUT = 100mA | 0.1 | mA | |||||
–12 | 12 | % | |||||
IOUT = 75mA | 0.072 | mA | |||||
–16 | 16 | % | |||||
IOUT = 30mA | 0.03 | mA | |||||
–35 | 35 | % | |||||
IOUT = 15mA | 0.014 | mA | |||||
–75 | 75 | % | |||||
SNS CHARACTERISTICS | |||||||
VSNSFH | VSNS fault high-level | VDIAG_EN = 5V, RSNS= 1kΩ | 4.5 | 5 | 5.2 | V | |
VDIAG_EN = 3.3V, RSNS= 1kΩ | 3.2 | 3.6 | 3.9 | V | |||
VDIAG_EN = 1.8V, RSNS= 1kΩ | 3.2 | 3.6 | 3.9 | V | |||
ISNSFH | ISNS fault high-level | VDIAG_EN > VIH,DIAG_EN | 4.5 | 6.5 | mA | ||
VBB_ISNS | VBB headroom needed for full current sense and fault functionality | VDIAG_EN = 3.3V | Measured with respect to GND pin of device | 5 | V | ||
VDIAG_EN = 5V | 6.5 | V | |||||
CURRENT LIMIT CHARACTERISTICS | |||||||
ICL | ICL current limit setting | RILIM > 60kΩ (ILIM = OPEN) | 3.8 | 4.8 | 5.6 | A | |
RILIM < 1.1kΩ (ILIM = GND) | 1.9 | 2.2 | 2.4 | A | |||
RILIM = 2.49kΩ | 1.9 | A | |||||
RILIM = 4.87kΩ | 1.7 | A | |||||
RILIM = 9.76kΩ | 1.5 | A | |||||
RILIM = 16.5kΩ | 1.1 | 1.25 | 1.4 | A | |||
RILIM = 23.2kΩ | 1 | A | |||||
RILIM = 31.6kΩ | 0.75 | A | |||||
RILIM = 43.2kΩ(1) | 0.5 | A | |||||
RILIM = 57.6kΩ(1) | 0.19 | 0.25 | 0.32 | A | |||
ICL_LINPK | Linear Mode peak | TJ = –40°C to 150°C, dI/dt < 0.01 A/ms |
IILIM = 0.25A to 2.2A | 1.6 × ICL | A | ||
ICL_ENPS | Peak current enabling into permanent short | TJ = –40°C to 150°C | Load = 5uH +100mΩ | 2.25 × ICL | A | ||
IOVCR | OVCR Peak current when short is applied while switch enabled | TJ = –40°C to 150°C | Load = 5uH +100mΩ | 12 | A | ||
FAULT CHARACTERISTICS | |||||||
ROL | Open-load (OL) detection internal resistor | VEN = 0V, VDIAG_EN = 5V | 100 | 150 | 175 | kΩ | |
tOL | Open-load (OL) detection deglitch time | VEN = 0V, VDIAG_EN = 5V, When VBB – VOUT < VOL, duration longer than tOL. Openload detected. | 300 | 500 | µs | ||
VOL | Open-load (OL) detection voltage | VEN = 0V, VDIAG_EN = 5V | 1.5 | V | |||
tOL1 | OL and STB indication-time from EN falling | VEN = 5V to 0V, VDIAG_EN = 5V IOUT = 0mA, VOUT = VBB – VOL |
500 | µs | |||
tOL2 | OL and STB indication-time from DIA_EN rising | VEN = 0V, VDIAG_EN = 0V to 5V IOUT = 0mA, VOUT = VBB – VOL |
600 | µs | |||
TABS | CHx Thermal shutdown threshold | 162 | °C | ||||
THYS | CHx Thermal shutdown hysteresis | 30 | °C | ||||
TREL | CHx Relative thermal shutdown | 80 | °C | ||||
tFAULT_FLT | Fault indication-time | VDIAG_EN = 5V Time between fault and FLT asserting |
60 | µs | |||
tFAULT_SNS | Fault indication-time | VDIAG_EN = 5V Time between fault and ISNS settling at VSNSFH |
60 | µs | |||
tRETRY | Retry time | Time from fault shutdown until switch re-enable (thermal shutdown). | 1 | 2 | 3 | ms | |
LOW POWER MODE | |||||||
ILPM,enter | Load current level for entry to LPM | t > tSTBY | 83 | 110 | 137 | mA | |
ILPM,exit | Load current level for exit of LPM | 130 | 165 | 200 | mA | ||
RDSON,LPM | RDSON in Low Power Mode | 50mA ILOAD | 130 | mΩ | |||
IQ,LPM | Quiscent current per channel in LPM with all channels enabled | 0mA ILOAD | –40℃ to 125℃ | 20 | µA | ||
tLPM | LPM Transistion indication-time | Device in LPM transition out time between current increase and LPM asserting |
50 | µs | |||
tWAKE | Recovery/Exit time from LPM | Device in LPM transition out time between wake interrupt (EN, DIAG_EN pin) and LPM asserting |
50 | µs | |||
IPKLPM,exit | Current peak coming out of LPM. Current setting ≤ 2.25A | Peak current for immediate shutoff in LPM | –40℃ to 125℃ | 1.6×ILIM | |||
DIGITAL INPUT PIN CHARACTERISTICS | |||||||
VIL, DIN | Input voltage low-level | No GND Network | 0.8 | V | |||
VIH, DIN | Input voltage high-level | No GND Network | 1.5 | V | |||
VIHYS, DIN | Input voltage hysteresis | 100 | mV | ||||
RPD_DIN | Internal pulldown resistor for ENx, DIAG_EN | 0.7 | 1 | 1.3 | MΩ | ||
Internal pulldown resistor for SEL0, SEL1 | 0.7 | 1 | 1.3 | MΩ | |||
IIH, DIN | Input current high-level for SEL0, SEL1 | VDINx = 5.5V | 10 | µA | |||
Input current high-level for DIAG_EN | VDIAG_EN = 5.5V | 30 | µA | ||||
IIH, DIN | Input current high-level for ENx | VENx = 5.5V | 30 | µA | |||
DIGITAL OUTPUT PIN CHARACTERISTICS | |||||||
VLPM | LPM low output voltage | ILPM = 2mA | 0.4 | V | |||
VFLT | FLT low output voltage | IFLT = 2mA | 0.4 | V |