JAJSH63C JULY   2012  – April 2019 TPS53015

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Drivers
      2. 7.3.2 5-Volt Regulator
      3. 7.3.3 Soft-Start and Pre-biased Soft-Start Time
      4. 7.3.4 Overcurrent Protection
      5. 7.3.5 Overvoltage and Undervoltage Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
      8. 7.3.8 Power Good
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 Auto-skip Eco-Mode Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Determine the Inductance Value
        2. 8.2.2.2 Output Capacitor
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Bootstrap Capacitor
        5. 8.2.2.5 VREG5 Capacitor
        6. 8.2.2.6 Choose Output Voltage Resistors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 商標
    2. 11.2 静電気放電に関する注意事項
    3. 11.3 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TPS53015 UNIT
DGS (VSSOP)
10 PINS
RθJA Junction-to-ambient thermal resistance 109.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 31.2 °C/W
RθJB Junction-to-board thermal resistance 54.7 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 54.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.