JAJSH63C JULY   2012  – April 2019 TPS53015

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション概略図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Drivers
      2. 7.3.2 5-Volt Regulator
      3. 7.3.3 Soft-Start and Pre-biased Soft-Start Time
      4. 7.3.4 Overcurrent Protection
      5. 7.3.5 Overvoltage and Undervoltage Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
      8. 7.3.8 Power Good
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 Auto-skip Eco-Mode Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Determine the Inductance Value
        2. 8.2.2.2 Output Capacitor
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Bootstrap Capacitor
        5. 8.2.2.5 VREG5 Capacitor
        6. 8.2.2.6 Choose Output Voltage Resistors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 商標
    2. 11.2 静電気放電に関する注意事項
    3. 11.3 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1 Layout Guidelines

Considerations these design guidelines before beginning the application layout process.

  • Design an input switching current loop as small as possible.
  • Place the input capacitor close to the top switching FET.
  • Design the output switching current loop as small as possible.
  • The SW node must be physically small and as short as possible as to minimize parasitic capacitance and inductance and to minimize radiated emissions.
  • Bring Kelvin connections from the output to the feedback pin (VFB) of the device.
  • Place analog and non-switching components far away from switching components.
  • Make a single point connection from the signal ground to power ground.
  • Do not allow switching current to flow under the device.