7.5 Dissipation Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
PACKAGE |
TA = 25°C
POWER RATING |
TA = 70°C
POWER RATING |
TA = 85°C
POWER RATING |
20-Pin PWP with solder |
3.85 W(3) |
2.12 W |
1.54 W |
20-Pin PWP without solder |
1.73 W |
0.96 W |
0.69 W |
(1) For more information on the PWP package, refer to TI technical brief, literature number SLMA002.
(2) Test board conditions:
- 3 inch × 3 inch, 2 layers, Thickness: 0.062 inch
- 1.5 oz copper traces located on the top of the PCB
- 1.5 oz copper ground plane on the bottom of the PCB
- Ten thermal vias (see recommended land pattern in application section of this data sheet)
(3) Maximum power dissipation may be limited by overcurrent protection.